XC2S300E-6FTG256I
Part Number XC2S300E-6FTG256I Manufacturer Xilinx
BGA Alloy No Pb/Lead Free Date Code 0829
Package/Case 600 PCS Description Original new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003844
No customer reviews for the moment.
16 other products in the same category
XC2S300E-6FTG256I
