SOIC16 SOP16 To DIP16 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000
SOIC16 SOP16 To DIP16 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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SOIC16 SOP16 To DIP16 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000
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