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RICHTEK RT8209BGQWA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002055
3,45 €

RICHTEK RT8209BGQW A0=

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R270 V120 CAS4 BDM Programmatore chiave per automobili BMW 20012009 Diagnostica automatica Strumento

1. Software Version: 1.2

2. Supported for BMW Car Model Year: Most 2001-2009

3. Support M35080 Series of Quick Clear, Read and Write (35080/35080-V6/35080-VP/D80 D0WQ/D160/35160, etc.)

Language: English

Description:

Directly read and write chip data quickly and safely, support the new 2009 7 Series (F01/F02) CAS4 odometer and chips read and write data,safe and effective.

CAS4 includes all the features of CAS3 programmer. It has a powerful Motorola MCU programming function: removing-free programm Motorola MCU EEPROM (HC908) and FLASH (HC912, HC9S12, HC9S12X) series.

Function:

1.Support CAS and CAS4 (0K50E/2K79X/0L01Y/0L15Y/1L15Y, etc.)

2.Support EWS4 (2L86D)

3.Support for Benz EZS (1J35D/2J74Y/4J74Y/3K91D/1L85D/1L59W/3L40K/4L 40K, etc.)

4.Supports a variety of SRS modules:(9H91F/0K13J/0K75F/0L85D/0J38M/1E62H/1K7 9X/5H55W, etc.)

5.Applicable to all kinds of EIS/CAS/SRS/ECU automotive modules.

Package List:

1x R270 Main Unit

1x 26Pin Cable

1x AC Adapter

1x USB Cable

1x Adapter

1x CD Drive

CH002056
47,24 €

R270 V1.20 CAS4 BDM Programmatore chiave per auto BMW (2001-2009) Strumento diagnostico automatico

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Intersil ISL6520A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002057
3,45 €

Intersil ISL6520A

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EZP2013 Programmatore USB SPI 24 25 93 EEPROM Flash Bios win8 3264bit

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include(5 items):

1 x EZP2013 programmer;

1 x USB 2.0 12Mbps cable;

1 x CD with user manual and install software & driver;

2 x Simple SMD PIN8 DIP

CH002058
13,30 €

EZP2013 Programmatore USB SPI 24 25 93 EEPROM Flash Bios win8 32/64bit

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N12MGS2SA1 GT520M

N12M-GS2-S-A1 GT520M

Part Number N12M-GS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1510

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002059
32,66 €

N12M-GS2-S-A1 GT520M

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TI TPS51020

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002060
3,45 €

TI TPS51020

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Maxim MAX8734AEEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002062
3,45 €

Maxim MAX8734AEEI

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TI BQ24742

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002063
3,45 €

TI BQ24742

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OZMICRO OZ8390ESLN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002064
4,77 €

OZMICRO OZ8390ESLN

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ITE IT8985E AXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002065
7,15 €

ITE IT8985E AXA

RICHTEK RT8209BGQWA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002055
3,45 €

RICHTEK RT8209BGQW A0=

wishlist
Compare

R270 V120 CAS4 BDM Programmatore chiave per automobili BMW 20012009 Diagnostica automatica Strumento

1. Software Version: 1.2

2. Supported for BMW Car Model Year: Most 2001-2009

3. Support M35080 Series of Quick Clear, Read and Write (35080/35080-V6/35080-VP/D80 D0WQ/D160/35160, etc.)

Language: English

Description:

Directly read and write chip data quickly and safely, support the new 2009 7 Series (F01/F02) CAS4 odometer and chips read and write data,safe and effective.

CAS4 includes all the features of CAS3 programmer. It has a powerful Motorola MCU programming function: removing-free programm Motorola MCU EEPROM (HC908) and FLASH (HC912, HC9S12, HC9S12X) series.

Function:

1.Support CAS and CAS4 (0K50E/2K79X/0L01Y/0L15Y/1L15Y, etc.)

2.Support EWS4 (2L86D)

3.Support for Benz EZS (1J35D/2J74Y/4J74Y/3K91D/1L85D/1L59W/3L40K/4L 40K, etc.)

4.Supports a variety of SRS modules:(9H91F/0K13J/0K75F/0L85D/0J38M/1E62H/1K7 9X/5H55W, etc.)

5.Applicable to all kinds of EIS/CAS/SRS/ECU automotive modules.

Package List:

1x R270 Main Unit

1x 26Pin Cable

1x AC Adapter

1x USB Cable

1x Adapter

1x CD Drive

CH002056
47,24 €

R270 V1.20 CAS4 BDM Programmatore chiave per auto BMW (2001-2009) Strumento diagnostico automatico

wishlist
Compare

Intersil ISL6520A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002057
3,45 €

Intersil ISL6520A

wishlist
Compare

EZP2013 Programmatore USB SPI 24 25 93 EEPROM Flash Bios win8 3264bit

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include(5 items):

1 x EZP2013 programmer;

1 x USB 2.0 12Mbps cable;

1 x CD with user manual and install software & driver;

2 x Simple SMD PIN8 DIP

CH002058
13,30 €

EZP2013 Programmatore USB SPI 24 25 93 EEPROM Flash Bios win8 32/64bit

wishlist
Compare

N12MGS2SA1 GT520M

N12M-GS2-S-A1 GT520M

Part Number N12M-GS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1510

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002059
32,66 €

N12M-GS2-S-A1 GT520M

wishlist
Compare

TI TPS51020

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002060
3,45 €

TI TPS51020

wishlist
Compare

Maxim MAX8734AEEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002062
3,45 €

Maxim MAX8734AEEI

wishlist
Compare

TI BQ24742

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002063
3,45 €

TI BQ24742

wishlist
Compare

OZMICRO OZ8390ESLN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002064
4,77 €

OZMICRO OZ8390ESLN

wishlist
Compare

ITE IT8985E AXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002065
7,15 €

ITE IT8985E AXA

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Compare
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