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GP102400A1 Stencil Template

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BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002260
6,22 €

Modello GP102-400-A1 Stencil

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GK107425A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002261
5,40 €

GK107-425-A2 Stencil Template

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MCP75LB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002262
5,40 €

MCP75L-B3 Stencil Template

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BROADCOM BCM5764

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002263
3,45 €

BROADCOM BCM5764

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Winbond 25Q64CVAIG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002265
3,45 €

Winbond 25Q64CVAIG

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Ciao

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002266
4,77 €

Ciao

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G84975A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002267
5,40 €

Modello G84-975-A2 Stencil

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J3355 SR2Z8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002268
9,82 €

J3355 SR2Z8 Stencil Template 90*90

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AO4600

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002269
3,45 €

AO4600

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G84603A2 8600MGT 128Bit 256M b

G84-603-A2 8600MGT 128Bit 256Mb

Part Number G84-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1304

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002270
49,23 €

G84-603-A2 8600MGT 128Bit 256M b

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PS10A Digital Ultrasonic Cleaner Timer del riscaldatore dell'acciaio inossidabile del grado industriale 20L

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH002271
98,83 €

PS-10A Digital Ultrasonic Cleaner Timer del riscaldatore dell\'acciaio inossidabile del grado industriale 2.0L

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GL82H170 SR2C8

GL82H170 SR2C8

Part Number GL82H170 SR2C8 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002272
41,03 €

GL82H170 SR2C8

GP102400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002260
6,22 €

Modello GP102-400-A1 Stencil

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GK107425A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002261
5,40 €

GK107-425-A2 Stencil Template

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Compare

MCP75LB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002262
5,40 €

MCP75L-B3 Stencil Template

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Compare

BROADCOM BCM5764

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002263
3,45 €

BROADCOM BCM5764

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Compare

Winbond 25Q64CVAIG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002265
3,45 €

Winbond 25Q64CVAIG

wishlist
Compare

Ciao

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002266
4,77 €

Ciao

wishlist
Compare

G84975A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002267
5,40 €

Modello G84-975-A2 Stencil

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Compare

J3355 SR2Z8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002268
9,82 €

J3355 SR2Z8 Stencil Template 90*90

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Compare

AO4600

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002269
3,45 €

AO4600

wishlist
Compare

G84603A2 8600MGT 128Bit 256M b

G84-603-A2 8600MGT 128Bit 256Mb

Part Number G84-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1304

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002270
49,23 €

G84-603-A2 8600MGT 128Bit 256M b

wishlist
Compare

PS10A Digital Ultrasonic Cleaner Timer del riscaldatore dell'acciaio inossidabile del grado industriale 20L

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH002271
98,83 €

PS-10A Digital Ultrasonic Cleaner Timer del riscaldatore dell\'acciaio inossidabile del grado industriale 2.0L

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GL82H170 SR2C8

GL82H170 SR2C8

Part Number GL82H170 SR2C8 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002272
41,03 €

GL82H170 SR2C8

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