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Set adattatore TSOP56 completo Presa IC solo per programmatore TNM5000 Modello 556T2

TNM5000 TSOP56 adapter Device support list

TSOP56 adapter Device support list

Login to Download: * items list Download

lease note: This adapter set is only for TNM5000 Programmer. Other programmers cannot use it!

Description:

This adapter set can be used for TSOP56 package chips. For All 56 Pins TSOP Type-1 (20mm Pin-Pin Lenght) , You Need Only one adaptor Model 556T2 , with different sets of bottom plates which can be easily exchanged by user.

The set comes with 1 TSOP56 ZIF board and 4 base boards, just like the pictures show.

Package include:

1pcs TNM TSOP56 ZIF Socket top board (made in Japan)

1pcs TNM TSOP561 bottom board

1pcs TNM TSOP562 bottom board

1pcs TNM TSOP563 base board

1pcs TNM TSOP564 base board

CH002442
69,00 €

Set adattatore TSOP56 completo Presa IC solo per programmatore TNM5000 Modello 556T2

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TI BQ24721TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002443
3,45 €

TI BQ24721TI

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Massimo MAX17000

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002444
4,77 €

Massimo MAX17000

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Q12H3A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002448
7,46 €

Q12H-3-A2 Stencil Template

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ENE KB926QF C)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002449
3,45 €

ENE KB926QF C)

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Apple BIOS MBA11 2011 A1370 8203024 EMC2471

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002451
30,71 €

Apple BIOS MBA11 2011 A1370 820-3024 EMC2471

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BCM5347MA1KPBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002453
47,66 €

BCM5347MA1KPBG

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Intersil ISL62884CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002455
3,45 €

Intersil ISL62884CHRTZ

Set adattatore TSOP56 completo Presa IC solo per programmatore TNM5000 Modello 556T2

TNM5000 TSOP56 adapter Device support list

TSOP56 adapter Device support list

Login to Download: * items list Download

lease note: This adapter set is only for TNM5000 Programmer. Other programmers cannot use it!

Description:

This adapter set can be used for TSOP56 package chips. For All 56 Pins TSOP Type-1 (20mm Pin-Pin Lenght) , You Need Only one adaptor Model 556T2 , with different sets of bottom plates which can be easily exchanged by user.

The set comes with 1 TSOP56 ZIF board and 4 base boards, just like the pictures show.

Package include:

1pcs TNM TSOP56 ZIF Socket top board (made in Japan)

1pcs TNM TSOP561 bottom board

1pcs TNM TSOP562 bottom board

1pcs TNM TSOP563 base board

1pcs TNM TSOP564 base board

CH002442
69,00 €

Set adattatore TSOP56 completo Presa IC solo per programmatore TNM5000 Modello 556T2

wishlist
Compare

TI BQ24721TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002443
3,45 €

TI BQ24721TI

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Massimo MAX17000

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002444
4,77 €

Massimo MAX17000

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Adattatore DC Jack 5521mm per Lenovo ThinkPad 10 Tablet

Product Details

Work for ThinkPad 10 Tablet.

Connector:DC Jack 5.5*2.1mm; Rectangle plug Adapter For ThinkPad 10 Tablet.

Length: 4.5 cm (1.77 inch ).

Please make sure the Tip Connecter size of the AC adapter are identical to what your need before buying.

CH002446
4,60 €

Adattatore DC Jack 5.5 *2.1mm per Lenovo ThinkPad 10 Tablet

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Q12H3A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002448
7,46 €

Q12H-3-A2 Stencil Template

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ENE KB926QF C)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002449
3,45 €

ENE KB926QF C)

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Apple BIOS MBA11 2011 A1370 8203024 EMC2471

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002451
30,71 €

Apple BIOS MBA11 2011 A1370 820-3024 EMC2471

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BGA48 01 V20 presa per MX29GL640 S29GL064N Adattatore NOR lettura e scrittura sedile per RT809H

RT809H special seat LFBGA48-8X6 0.8 spacing

Applicable to set-top boxes commonly used MX29GL640, S29GL064N and other models of NOR flash offline reading and writing seat

Encapsulation is LFBGA48, 8*6mm, spacing 0.8mm

CH002452
48,90 €

RT-BGA48-01 V2.0 TV Scatola comunemente usato MX29GL640, S29GL064N altri modelli NOR sedile di lettura e scrittura off-line per RT809H

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BCM5347MA1KPBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002453
47,66 €

BCM5347MA1KPBG

wishlist
Compare

Intersil ISL62884CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002455
3,45 €

Intersil ISL62884CHRTZ

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