• Show Sidebar

Ci sono 5250 prodotti.

Filtri attivi

wishlist
Compare
Quickview

MCP79DB3

MCP79D-B3

Part Number MCP79D-B3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002483
24,62 €

MCP79D-B3

wishlist
Compare
Quickview

i72720QM SR00W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002484
5,40 €

I7-2720QM SR00W Stencil Template

wishlist
Compare
Quickview

6in1 Stencil Template BGA153 162 169 186 221 254 EMCP EMMC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002486
9,82 €

6in1 Stencil Template BGA153 /162 /169 /186 /221 /254 EMCP EMMC

wishlist
Compare
Quickview

Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad

Multifunctional Repair /Soldering Mat

Silicone Heat Mat Set: * Silicone Heat Mat Repair Insulation Kit Mobile Computer Tablets Phones Fix Pad

Insulation, Retardant, Anti-skid, Anti-static, Anti-corrosion, Magnetic Storage, Odorless, Foldable

FEATURES:

?500C Heat Resistant

?Strong Classification and Storage Performance, make your working desk clean and tiny and improve work efficiency

?Heat Accumulation Characteristics: Accumulate heat on this pad. It will be quicker and more convenient while soldering the CPU

?Eco-friendly Silicone: Non-toxic, odorless. The mat is made of high quality silicone. It resists corrosion and out of shape. Its texture is soft, solid and durable to protect soldering iron tip.

?Easy to clean: It easily cleaned nice with soap and water or even rubbing alcohol in daily use. Mats environmental safety is conducive to improving the working environment of technicians.

?Professional Heat Isolation Mat: And you can also use it big pads as pot holders for pots, pans, trays...

?You can even place it that is heat-resistant, non-slip on tables or counters for pots and pans.

SPECIFICATIONSS:

-Item Name: Multipurpose Repair pad/Soldering Mat

-Dimension: 495*34.8mm

-Weight: 515g

-Material: Silicone

-Color: Blue

CH002487
16,78 €

Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad

wishlist
Compare
Quickview

TI BQ735 BQ24735 BQ24735RGRR QFN20 CHIPSET

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002488
3,45 €

TI BQ735 BQ24735 BQ24735RGRR QFN-20 CHIPSET

wishlist
Compare
Quickview

MT6320 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002489
5,59 €

MT6320 Stencil Template

wishlist
Compare
Quickview

N12MGSB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002490
5,40 €

N12M-GE-S-B1 Stencil Template

wishlist
Compare
Quickview

Winbond WPC8763LDG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002491
3,45 €

Winbond WPC8763LDG

wishlist
Compare
Quickview

GL82H110 SR2CA

GL82H110 SR2CA

Part Number GL82H110 SR2CA Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002492
43,62 €

GL82H110 SR2CA

wishlist
Compare
Quickview

2160858030

216-0858030

Part Number 216-0858030 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002494
29,26 €

216-0858030

MCP79DB3

MCP79D-B3

Part Number MCP79D-B3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002483
24,62 €

MCP79D-B3

wishlist
Compare

i72720QM SR00W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002484
5,40 €

I7-2720QM SR00W Stencil Template

wishlist
Compare

6in1 Stencil Template BGA153 162 169 186 221 254 EMCP EMMC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002486
9,82 €

6in1 Stencil Template BGA153 /162 /169 /186 /221 /254 EMCP EMMC

wishlist
Compare

Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad

Multifunctional Repair /Soldering Mat

Silicone Heat Mat Set: * Silicone Heat Mat Repair Insulation Kit Mobile Computer Tablets Phones Fix Pad

Insulation, Retardant, Anti-skid, Anti-static, Anti-corrosion, Magnetic Storage, Odorless, Foldable

FEATURES:

?500C Heat Resistant

?Strong Classification and Storage Performance, make your working desk clean and tiny and improve work efficiency

?Heat Accumulation Characteristics: Accumulate heat on this pad. It will be quicker and more convenient while soldering the CPU

?Eco-friendly Silicone: Non-toxic, odorless. The mat is made of high quality silicone. It resists corrosion and out of shape. Its texture is soft, solid and durable to protect soldering iron tip.

?Easy to clean: It easily cleaned nice with soap and water or even rubbing alcohol in daily use. Mats environmental safety is conducive to improving the working environment of technicians.

?Professional Heat Isolation Mat: And you can also use it big pads as pot holders for pots, pans, trays...

?You can even place it that is heat-resistant, non-slip on tables or counters for pots and pans.

SPECIFICATIONSS:

-Item Name: Multipurpose Repair pad/Soldering Mat

-Dimension: 495*34.8mm

-Weight: 515g

-Material: Silicone

-Color: Blue

CH002487
16,78 €

Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad

wishlist
Compare

TI BQ735 BQ24735 BQ24735RGRR QFN20 CHIPSET

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002488
3,45 €

TI BQ735 BQ24735 BQ24735RGRR QFN-20 CHIPSET

wishlist
Compare

MT6320 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002489
5,59 €

MT6320 Stencil Template

wishlist
Compare

N12MGSB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002490
5,40 €

N12M-GE-S-B1 Stencil Template

wishlist
Compare

Winbond WPC8763LDG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002491
3,45 €

Winbond WPC8763LDG

wishlist
Compare

GL82H110 SR2CA

GL82H110 SR2CA

Part Number GL82H110 SR2CA Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002492
43,62 €

GL82H110 SR2CA

wishlist
Compare

2160858030

216-0858030

Part Number 216-0858030 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002494
29,26 €

216-0858030

wishlist
Compare
Back to top