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N11MPT1SA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002531
5,40 €

N11M-PT1-S-A3 Stencil Template

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LGA 1150 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002532
19,27 €

LGA 1150 Stencil Template

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FAIRCHILD FDS6900

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002533
3,45 €

FAIRCHILD FDS6900

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RTL8201C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002534
3,45 €

RTL8201C

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mela 339S0209

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002535
5,56 €

mela 339S0209

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BD82QS77 SLJ8B

BD82QS77 SLJ8B

Part Number BD82QS77 SLJ8B Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002536
45,26 €

BD82QS77 SLJ8B

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Scheda di test diagnostico dell'analizzatore del LED della fessura di memoria della scheda madre del PC Desktop DDR4 RAM

Product Information

Desktop PC Motherboard DDR4 RAM Memory Slot Repair Test Tester Card with LED

Item Condition:

New

Part Description:

1pcs * DDR4 DDR 4 RAM Memory Slot Tester With LED Indicator For Desktop PC Computer

Part Number:

PC Computer DDR4 RAM Tester Card

Part Info1:

Size: 130mm length x 45mm height

Part Info2:

Checking open or short circuit or data line

Part Info3:

* Excluded 3.3V CR2032 Battery

Product Weight:

30g

Product Content

DDR4 illuminated test card fully supports INTEL, AMD all motherboards DDR4 interface, can quickly and accurately test the motherboard various data and address lines open, short, use bright LED on and off to indicate that each bus and a control signal, replaces the traditional method of individually measured with a multimeter, easy to use, intuitive, it is an indispensable tool for maintaining computer motherboard.

Instructions for use:

1, will be equipped with a battery (CR2032,3V) Insert the battery holder and the test card is inserted in the corresponding model of the motherboard, the motherboard plug in CPU, press the switch on the test card, you can determine the open portion of the motherboard memory, short-circuit fault , such as a lamp is not lit, check whether the CPU socket and memory slots open or shorted to ground. If a special bright light, you will have to check whether the lamp short to power.

2, the tester can also be false load resistance card.

Precautions:

1, after repeated use, the tester dimming, because the tester battery voltage is not enough, ask the user to replace the battery.

2, various signals of this tester, because various manufacturers and chipset motherboard design, it may show a different part of the signal, maintenance personnel with the same control board can determine fault.

CH002537
13,55 €

Desktop PC Scheda madre DDR4 RAM Scheda di prova dell\'analizzatore diagnostico di memoria

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CD3215C00

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002538
12,39 €

CD3215C00

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N13EGS1LPA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002539
5,47 €

N13E-GS1-LP-A1 Stencil Template

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1610A3

1610A3

Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002540
3,97 €

1610A3

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ITE IT8502E KXT

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002542
3,45 €

ITE IT8502E (KXT)

N11MPT1SA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002531
5,40 €

N11M-PT1-S-A3 Stencil Template

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Compare

LGA 1150 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002532
19,27 €

LGA 1150 Stencil Template

wishlist
Compare

FAIRCHILD FDS6900

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002533
3,45 €

FAIRCHILD FDS6900

wishlist
Compare

RTL8201C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002534
3,45 €

RTL8201C

wishlist
Compare

mela 339S0209

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002535
5,56 €

mela 339S0209

wishlist
Compare

BD82QS77 SLJ8B

BD82QS77 SLJ8B

Part Number BD82QS77 SLJ8B Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002536
45,26 €

BD82QS77 SLJ8B

wishlist
Compare

Scheda di test diagnostico dell'analizzatore del LED della fessura di memoria della scheda madre del PC Desktop DDR4 RAM

Product Information

Desktop PC Motherboard DDR4 RAM Memory Slot Repair Test Tester Card with LED

Item Condition:

New

Part Description:

1pcs * DDR4 DDR 4 RAM Memory Slot Tester With LED Indicator For Desktop PC Computer

Part Number:

PC Computer DDR4 RAM Tester Card

Part Info1:

Size: 130mm length x 45mm height

Part Info2:

Checking open or short circuit or data line

Part Info3:

* Excluded 3.3V CR2032 Battery

Product Weight:

30g

Product Content

DDR4 illuminated test card fully supports INTEL, AMD all motherboards DDR4 interface, can quickly and accurately test the motherboard various data and address lines open, short, use bright LED on and off to indicate that each bus and a control signal, replaces the traditional method of individually measured with a multimeter, easy to use, intuitive, it is an indispensable tool for maintaining computer motherboard.

Instructions for use:

1, will be equipped with a battery (CR2032,3V) Insert the battery holder and the test card is inserted in the corresponding model of the motherboard, the motherboard plug in CPU, press the switch on the test card, you can determine the open portion of the motherboard memory, short-circuit fault , such as a lamp is not lit, check whether the CPU socket and memory slots open or shorted to ground. If a special bright light, you will have to check whether the lamp short to power.

2, the tester can also be false load resistance card.

Precautions:

1, after repeated use, the tester dimming, because the tester battery voltage is not enough, ask the user to replace the battery.

2, various signals of this tester, because various manufacturers and chipset motherboard design, it may show a different part of the signal, maintenance personnel with the same control board can determine fault.

CH002537
13,55 €

Desktop PC Scheda madre DDR4 RAM Scheda di prova dell\'analizzatore diagnostico di memoria

wishlist
Compare

CD3215C00

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002538
12,39 €

CD3215C00

wishlist
Compare

N13EGS1LPA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002539
5,47 €

N13E-GS1-LP-A1 Stencil Template

wishlist
Compare

1610A3

1610A3

Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002540
3,97 €

1610A3

wishlist
Compare

ITE IT8502E KXT

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002542
3,45 €

ITE IT8502E (KXT)

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