New laptop DDR3 lamp test instructions

Product synopsis:

This product for a generation notebook DDR3 test lamp upgrade the product, product comprehensive support laptop forward and reverse interface, it is to use leds light and destroy data to indicate the signals of opening address lines with short circuit, instead of traditional using a multimeter measurement method for them one by one, to repair it didn't turn on, don't show, don't read the fault of memory and so on the mainboard, maintenance is an essential tool notebook computer motherboard.

Instructions:

1, with the 3.3 V in tester (CR2032) battery, insert the corresponding notebook motherboard respectively of DDR3 memory each slot, mainboard don't have electricity, the bright and brightness lamp test consistent, signal lines that normal, if has the bright lights or very bright, indicating that this signal have open short-circuit fault, using a multimeter to further define the fault point. (note: all kinds of signals, because tester in each of the contractor the mainboard design and the different chipset, a part of the signal may show that the different, please maintenance personnel using the same motherboard control judge fault.)

2, memory pin the corresponding signal in the list below:

204-PIN SO-UDIMM PINOUT

204-Pin SO-UDIMM Front

204-Pin SO-UDIMM Back

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

1

VREFDQ

53

DQ19

105

VDD

157

DQ42

2

VSS

54

VSS

106

VDD

158

DQ46

3

VSS

55

VSS

107

A10/AP

159

DQ43

4

DQ4

56

DQ28

108

BA1

160

DQ47

5

DQ0

57

DQ24

109

BA0

161

VSS

6

DQ5

58

DQ29

110

/RAS

162

VSS

7

DQ1

59

DQ25

111

VDD

163

DQ48

8

VSS

60

VSS

112

VDD

164

DQ52

9

VSS

61

VSS

113

/WC

165

DQ49

10

/DQS0

62

/DQS3

114

/S0

166

DQ53

11

DMD

63

DM3

115

/CAS

167

VSS

12

DQS0

64

DQS3

116

ODT0

168

VSS

13

VSS

65

VSS

117

VDD

169

/DQS6

14

VSS

66

VSS

118

VDD

170

DM6

15

DQ2

67

DQ26

119

A13

171

DQS6

16

DQ6

68

DQ30

120

ODT1

172

VSS

17

DQ3

69

DQ27

121

/S1

173

VSS

18

DQ7

70

DQ31

122

NC

174

DQ54

19

VSS

71

VSS

123

VDD

175

DQ50

20

VSS

72

VSS

124

VDD

176

DQ55

21

DQ8

73

CKE0

125

TEST

177

DQ51

22

DQ12

74

CKE1

126

VREFCA

178

VSS

23

DQ9

75

VDD

127

VSS

179

VSS

24

DQ13

76

VDD

128

VSS

180

DQ60

25

VSS

77

NC

129

DQ32

181

DQ56

26

VSS

78

A15

130

DQ36

182

DQ61

27

/DQS1

79

BA2

131

DQ33

183

DQ57

28

DM1

80

A14

132

DQ37

184

VSS

29

DQS1

81

VDD

133

333

VSS

185

VSS

30

/RESET

82

VDD

134

VSS

186

/DQS7

31

VSS

83

A12VBC

135

/DQS4

187

DM7

32

VSS

84

A11

136

DM4

188

DQS7

33

DQ10

85

A6

137

DQS4

189

VSS

34

DQ14

86

A7

138

VSS

190

VSS

35

DQ11

87

VDD

139

VSS

191

DQ58

36

DQ15

88

VDD

140

DQ38

192

DQ52

37

VSS

89

A8

141

DQ34

193

DQ59

38

VSS

90

A4

142

DQ39

194

DQ53

39

DQ16

91

A5

143

DQ35

195

VSS

40

DQ20

92

A6

144

VSS

196

VSS

41

DQ17

93

VDD

145

VSS

197

SA0

42

DQ21

94

VDD

146

DQ44

198

/EVENT

43

VSS

95

A3

147

DQ40

199

VDDSPD

44

VSS

96

A2

148

DQ45

200

SDA

45

/DQS2

97

A1

149

DQ41

201

SA1

46

DM2

98

A0

150

VSS

202

SCL

47

DQS2

99

VDD

151

VSS

203

VTT

48

VSS

100

VDD

152

/DQS5

204

VTT

49

VSS

101

CK0

153

DM5

50

DQ22

102

CK1

154

DQS5

51

DQ18

103

/CK0

155

VSS

52

DQ23

104

/CK1

156/DQ

VSS

G73-VZ-H-N-A2

Part Number G73-VZ-H-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

MacBook Pro A1286 A1297 40P LCD LED LVDS Cable Connector

Part Number A1286 A1297 Connector Manufacturer Apple

Type Cable Connector Brand I-PEX

Package/Case 1 PCS Description Original new

Toshiba Satellite A35 Series DC Power Jack Connector: (PSA30U), A35-1593, A35-s159, A35-s1592, A35-s209, A35-s2091

Toshiba Satellite A60 Series: (PSA60U), A60-102, A60-106, A60-116, A60-120, A60-129, A60-140, A60-145, A60-154, A60-174, A60-185, A60-202, A60-212, A60-218, A60-219, A60-302, A60-332, A60-632, A60-652, A60-662, A60-672, A60-742, A60-743, A60-752, A60-772, A60-CJW, A60-CJWF, A60-JL1, A60-S1072, A60-S1173, A60-S156, A60-S1561, A60-S159, A60-S1591, A60-S1591ST, A60-S1592ST, A60-S166, A60-S1661, A60-S1662, A60-S1691STA60-SP126, A60-SP159, A60-WM1, A60-WM1F

Toshiba Satellite A65 Series: (PSA60U), A65-S1062, A65-S1063, A65-S1064, A65-S1065, A65-S1066, A65-S1067, A65-S1068, A65-S1069, A65-S1070, A65-S109, A65-S1091, A65-S126, A65-S1261, A65-S136, A65-S1361, A65-S1362, A65-S1607, A65-S1662, A65-S1762

Toshiba Satellite P30 Series: (PSP30U), P30-110, P30-119, P30-133, P30-141, P30-144, P30-145, P30-149, P30-S6362ST, P30-S6363ST, P30-S701TD

Toshiba Satellite P35 Series: (PSA30U), P35-S605, P35-S6051, P35-S6052, P35-S6053, P35-S609, P35-S6091, P35-S611, P35-S6111, P35-S6112, P35-S629, P35-S6291, P35-S6292, P35-S631, P35-S6311, P35-S7012

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

MAXIM MAX8765ETI MAX8765E Battery Charging IC/ Controller Chip

Part Number MAX8765ETI MAX8765E Manufacturer MAXIM

Type QFN28 Date Code 12+

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SATA 22Pin 7+15 Male to SATA 22P 7+15 Male extension convertor Straight adapter

HP and others please compare to Jack #11 & 15. This Jack stands 1.4mm higher at center pin, system board to center pin is 6.5mm.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.