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AD1981HD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002791
3,45 €

AD1981HD

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Scheda adattatore a 25 SATA per Apple MacBook Air A1370 A1369 SSD con cavo FPC

Features:

1.This product use original slot of Apple computer dedicated SSD !

2.Only support 2010 and 2011 version apple MacBook Air A1370 A1369 MC503 MC504 MC505 MC506 MC968 MC969 MC965 MC966 SSD to 2.5" SATA

3.The speed and other properties is not changed,only form conversion interface.

4.It can be suitable for some laptops because the separation design.

5.You can connect it to desktop.

Notice:

1: This product performance is being improved unceasingly, like has the change, not separate informs even slightly.Pictures for reference only, subject to our available products.

2: This product is only suitable for 6 + 12 pin of apple's original hard disk.

3: We do not guarantee the adapter card must be suitable for your laptop because each laptop hard disk position space is different.

4: Mac OS and some digital camera system use disk format can't compatible with Microsoft system,new SSD if there is no partition,open the "my computer" can't see the ssd, please use the Disk Manager in Windows to delete the partitions or to create a new partition on the SSD.

5: Please check your computer can support the SSD,some computer is too old,it is not compatible with SSD;There are some brand computer for a particular type of SSD is not compatible,

6: Please connect the adapter card in your computer hard disk drive interface test or with USB hard disk box to test the adapter card,if the SSD with a test method can't identify by computer,change other test method to check the SSD,If still can't identify please try to replace a computer,this operation can be ruled out compatibility problems.

7. Please use USB 3.0 interface test adapter card,because the old USB interface doesn't provide enough current for same SSD.

8. Only sales adapter card,the SSD is not included,just as the picture demonstration image effect of the SSD.

9. Please be sure to cancel all password protected of your solid-state hard disk!

10. Please pay attention to keep the gold finger of SSD is clean,it helps to avoid unwanted contact.

11. Please sure your machine can provide enough current to the SSD if your SSD brand is samsung.because samsung SSD need rated current is 2.39 A.

About MacBook Air SSD interface standard:

1: 2010 and 2011 version MacBook Air SSD is 6+12 pin, only one side have contact,size is 109 mm*24 mm.It's SATA interface.

2: 2012 version MacBook Air SSD is 7+17 pin, size is 109 mm*24 mm.2012 version MacBook Pro SSD is 7+17 pin, size is 89 mm*33 mm.It's SATA interface.

3: 2013 and 2014 and 2015 version MacBook Air SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*24 mm.It's PCIe X4 interface.

4: 2013 and 2014 and 2015 version MacBook Pro SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*33 mm.It's PCIe X4 interface.

CH002793
8,70 €

Scheda adattatore a 2.5 SATA per Apple MacBook Air A1370 A1369 SSD con cavo FPC

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TI BQ24157A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002794
3,45 €

TI BQ24157A

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Intersil ISL62881

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002795
3,45 €

Intersil ISL62881

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N10PGSA2 GT240M

N10P-GS-A2 GT240M

Part Number N10P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0925

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002796
30,36 €

N10P-GS-A2 GT240M

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21 Modelli 1400pcs Ferrite Bead SMD 751500 Ohm 0402 0603 0805 Pacchetto misto Kit

21 Models of the 0402 0603 0805 samples of three kinds of magnetic sunlord package

Brand: Sunlord

0402 magnetic beads: 7Models general type, each of 100, a total of 700pcs

0603 magnetic beads: 7Models general type, each of 50, a total of 350pcs

0805 magnetic beads: 7Models general type, each of 50, a total of 350pcs

CH002797
49,09 €

21 Modelli 1400pcs Ferrite Bead SMD 75-1500 Ohm 0402 0603 0805 Pacchetto misto Kit

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SIM90x90018001900 MHz GPRSGSM Modulo del consiglio di sviluppo per Arduino New

Feature:

The GPRS Shield is based on SIM900 module from SIMCOM and compatible with Arduino and its clones.

The GPRS Shield provides you a way to communicate using the GSM cell phone networks.

The shield allows you to achieve SMS, MMS, GPRS and Audio via UART by sending AT commands (GSM 07.07 ,07.05 and SIMCOM enhanced AT Commands).

The shield also has the 12 GPIOs, 2 PWMs and an ADC of the SIM900 module(They are all 2V8 logic) present onboard.

Quad-Band 850 / 900/ 1800 / 1900 MHz - would work on GSM networks in all countries across the world.

GPRS multi-slot class 10/8

GPRS mobile station class B

Compliant to GSM phase 2/2+

Class 4 (2 W @ 850 / 900 MHz)

Class 1 (1 W @ 1800 / 1900MHz)

Control via AT commands - Standard Commands: GSM 07.07 & 07.05

Enhanced Commands: SIMCOM AT Commands.

Short Message Service - so that you can send small amounts of data over the networks

(ASCII or raw hexadecimal).

Embedded TCP/UDP stack - allows you to upload data to a web server.

RTC supported.

Selectable serial port.

Speaker and Headphone jacks

Low power consumption - 1.5mA(sleep mode)

Industrial Temperature Range - -40C to +85 C

Size:8.5x5.7x2cm(approx)

Package including:

1 x GPRS/GSM Development Board Module

CH002798
21,13 €

SIM900 850/900/1800/1900 MHz GPRS/GSM Modulo del consiglio di sviluppo per Arduino New

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Massimo MAX1515

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002800
3,45 €

Massimo MAX1515

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06mm filo di ferro Sn63Pb37 MECHANIC HXT100 la qualità più fine 200g

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002801
9,82 €

Filo di saldatura di 0.6mm Sn63/Pb37 MECHANIC HX-T100 La qualità più fine 200g

wishlist
Compare
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N15PGTA2 GTX870M

N15P-GT-A2 GTX870M

Part Number N15P-GT-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1405

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002802
96,00 €

N15P-GT-A2 GTX870M

AD1981HD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002791
3,45 €

AD1981HD

wishlist
Compare

Scheda adattatore a 25 SATA per Apple MacBook Air A1370 A1369 SSD con cavo FPC

Features:

1.This product use original slot of Apple computer dedicated SSD !

2.Only support 2010 and 2011 version apple MacBook Air A1370 A1369 MC503 MC504 MC505 MC506 MC968 MC969 MC965 MC966 SSD to 2.5" SATA

3.The speed and other properties is not changed,only form conversion interface.

4.It can be suitable for some laptops because the separation design.

5.You can connect it to desktop.

Notice:

1: This product performance is being improved unceasingly, like has the change, not separate informs even slightly.Pictures for reference only, subject to our available products.

2: This product is only suitable for 6 + 12 pin of apple's original hard disk.

3: We do not guarantee the adapter card must be suitable for your laptop because each laptop hard disk position space is different.

4: Mac OS and some digital camera system use disk format can't compatible with Microsoft system,new SSD if there is no partition,open the "my computer" can't see the ssd, please use the Disk Manager in Windows to delete the partitions or to create a new partition on the SSD.

5: Please check your computer can support the SSD,some computer is too old,it is not compatible with SSD;There are some brand computer for a particular type of SSD is not compatible,

6: Please connect the adapter card in your computer hard disk drive interface test or with USB hard disk box to test the adapter card,if the SSD with a test method can't identify by computer,change other test method to check the SSD,If still can't identify please try to replace a computer,this operation can be ruled out compatibility problems.

7. Please use USB 3.0 interface test adapter card,because the old USB interface doesn't provide enough current for same SSD.

8. Only sales adapter card,the SSD is not included,just as the picture demonstration image effect of the SSD.

9. Please be sure to cancel all password protected of your solid-state hard disk!

10. Please pay attention to keep the gold finger of SSD is clean,it helps to avoid unwanted contact.

11. Please sure your machine can provide enough current to the SSD if your SSD brand is samsung.because samsung SSD need rated current is 2.39 A.

About MacBook Air SSD interface standard:

1: 2010 and 2011 version MacBook Air SSD is 6+12 pin, only one side have contact,size is 109 mm*24 mm.It's SATA interface.

2: 2012 version MacBook Air SSD is 7+17 pin, size is 109 mm*24 mm.2012 version MacBook Pro SSD is 7+17 pin, size is 89 mm*33 mm.It's SATA interface.

3: 2013 and 2014 and 2015 version MacBook Air SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*24 mm.It's PCIe X4 interface.

4: 2013 and 2014 and 2015 version MacBook Pro SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*33 mm.It's PCIe X4 interface.

CH002793
8,70 €

Scheda adattatore a 2.5 SATA per Apple MacBook Air A1370 A1369 SSD con cavo FPC

wishlist
Compare

TI BQ24157A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002794
3,45 €

TI BQ24157A

wishlist
Compare

Intersil ISL62881

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002795
3,45 €

Intersil ISL62881

wishlist
Compare

N10PGSA2 GT240M

N10P-GS-A2 GT240M

Part Number N10P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0925

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002796
30,36 €

N10P-GS-A2 GT240M

wishlist
Compare

21 Modelli 1400pcs Ferrite Bead SMD 751500 Ohm 0402 0603 0805 Pacchetto misto Kit

21 Models of the 0402 0603 0805 samples of three kinds of magnetic sunlord package

Brand: Sunlord

0402 magnetic beads: 7Models general type, each of 100, a total of 700pcs

0603 magnetic beads: 7Models general type, each of 50, a total of 350pcs

0805 magnetic beads: 7Models general type, each of 50, a total of 350pcs

CH002797
49,09 €

21 Modelli 1400pcs Ferrite Bead SMD 75-1500 Ohm 0402 0603 0805 Pacchetto misto Kit

wishlist
Compare

SIM90x90018001900 MHz GPRSGSM Modulo del consiglio di sviluppo per Arduino New

Feature:

The GPRS Shield is based on SIM900 module from SIMCOM and compatible with Arduino and its clones.

The GPRS Shield provides you a way to communicate using the GSM cell phone networks.

The shield allows you to achieve SMS, MMS, GPRS and Audio via UART by sending AT commands (GSM 07.07 ,07.05 and SIMCOM enhanced AT Commands).

The shield also has the 12 GPIOs, 2 PWMs and an ADC of the SIM900 module(They are all 2V8 logic) present onboard.

Quad-Band 850 / 900/ 1800 / 1900 MHz - would work on GSM networks in all countries across the world.

GPRS multi-slot class 10/8

GPRS mobile station class B

Compliant to GSM phase 2/2+

Class 4 (2 W @ 850 / 900 MHz)

Class 1 (1 W @ 1800 / 1900MHz)

Control via AT commands - Standard Commands: GSM 07.07 & 07.05

Enhanced Commands: SIMCOM AT Commands.

Short Message Service - so that you can send small amounts of data over the networks

(ASCII or raw hexadecimal).

Embedded TCP/UDP stack - allows you to upload data to a web server.

RTC supported.

Selectable serial port.

Speaker and Headphone jacks

Low power consumption - 1.5mA(sleep mode)

Industrial Temperature Range - -40C to +85 C

Size:8.5x5.7x2cm(approx)

Package including:

1 x GPRS/GSM Development Board Module

CH002798
21,13 €

SIM900 850/900/1800/1900 MHz GPRS/GSM Modulo del consiglio di sviluppo per Arduino New

wishlist
Compare

Prese del programmatore dell'adattatore SOP a PLCC 10 per l'TL866 RT809 H

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

CH002799
16,90 €

Prese del programmatore dell\'adattatore SOP a PLCC 10 per l\'TL866 RT809 H

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Massimo MAX1515

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002800
3,45 €

Massimo MAX1515

wishlist
Compare

06mm filo di ferro Sn63Pb37 MECHANIC HXT100 la qualità più fine 200g

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002801
9,82 €

Filo di saldatura di 0.6mm Sn63/Pb37 MECHANIC HX-T100 La qualità più fine 200g

wishlist
Compare

N15PGTA2 GTX870M

N15P-GT-A2 GTX870M

Part Number N15P-GT-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1405

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002802
96,00 €

N15P-GT-A2 GTX870M

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Compare
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