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i76820HQ SR2FU Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003058
6,84 €

modello SR2FU Stencil i7-6820HQ

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GTX1050TI N17PG1A1 Stencil Template

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BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003059
5,40 €

GTX1050TI N17P-G1-A1 Stencil Template

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ATHEROS AR8162BL3A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003060
3,45 €

ATHEROS AR8162-BL3A

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SR24B 3825U

SR24B 3825U

Part Number 3825U SR24B Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003061
78,77 €

SR24B 3825U

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K9F1G08U0DSCB0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003062
6,04 €

K9F1G08U0D-SCB0

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2160772000 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003064
17,14 €

216-0772000 Stencil Template 90*90

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TI TPS2061 D8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003065
3,45 €

TI TPS2061 D8

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G86771A2 8600MGS

G86-771-A2 8600MGS

Part Number G86-771-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1432

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003066
29,54 €

G86-771-A2 8600MGS

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HAYEAR 14 milioni di pixel Full HD schermo di colore fotocamera digitale ingranditore microscopio

Use Tutorials Video: * HAYEAR 14 Million Pixels Full HD

Feature:

14 megapixel Panas'onic sensor 1/2.3 inch

Effective pixel:14 megapixel

Pixel size:1.43*1.43um

Frame rate:60fps

Display:FULL HD

Material:metal,glass

Lens:CS for test, custom provide

White balance:Auto/manual

Digital magnification:5 times digital zoom

Brightness control:Auto/manual

Color:R/G/B adjustable

Freeze:Support

OSD:Support

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:Support multi-color, 5pcs of transverse lines/vertical lines, moveable

SNR:Support

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

Lens:C

USB interface :Standard usb2.0 interface (Type B)

Specification:

Model: Camera with HDMI USB2.0 two output

Image format: jpg,png,tiff

Image resolution: 4320*3240 (for TF card) 1920 *1080 @ 60FPS(for TF card)

Video format: MP4

Video recorder: 1920 *1080 @ 60FPS (for TF Card)

USB Video resolution: 1920 *1080 @ 30FPS

White Balance: Auto

Light: Auto

Color: Color

Negative: Support

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese

Line: different color,5 horizontal line , 5 vertical line,any positions

C-MOUNT Lens parameter:

Working distance: 55mm-200mm

Field of view: 2.4mm-36mm

zoom c-mount Lens:

Magnification Power by 8X~120X

Size: 100mm(L) * 25mm(DIA)

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

CH003067
172,81 €

HAYEAR 14 milioni di pixel Full HD schermo di colore fotocamera digitale ingranditore microscopio

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AUOP12301

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003068
3,45 €

AUO-P12301

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SEMTECH SC471

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003069
3,45 €

SEMTECH SC471

i76820HQ SR2FU Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003058
6,84 €

modello SR2FU Stencil i7-6820HQ

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Compare

GTX1050TI N17PG1A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003059
5,40 €

GTX1050TI N17P-G1-A1 Stencil Template

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Compare

ATHEROS AR8162BL3A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003060
3,45 €

ATHEROS AR8162-BL3A

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Compare

SR24B 3825U

SR24B 3825U

Part Number 3825U SR24B Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003061
78,77 €

SR24B 3825U

wishlist
Compare

K9F1G08U0DSCB0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003062
6,04 €

K9F1G08U0D-SCB0

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Compare

2160772000 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003064
17,14 €

216-0772000 Stencil Template 90*90

wishlist
Compare

TI TPS2061 D8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003065
3,45 €

TI TPS2061 D8

wishlist
Compare

G86771A2 8600MGS

G86-771-A2 8600MGS

Part Number G86-771-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1432

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003066
29,54 €

G86-771-A2 8600MGS

wishlist
Compare

HAYEAR 14 milioni di pixel Full HD schermo di colore fotocamera digitale ingranditore microscopio

Use Tutorials Video: * HAYEAR 14 Million Pixels Full HD

Feature:

14 megapixel Panas'onic sensor 1/2.3 inch

Effective pixel:14 megapixel

Pixel size:1.43*1.43um

Frame rate:60fps

Display:FULL HD

Material:metal,glass

Lens:CS for test, custom provide

White balance:Auto/manual

Digital magnification:5 times digital zoom

Brightness control:Auto/manual

Color:R/G/B adjustable

Freeze:Support

OSD:Support

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:Support multi-color, 5pcs of transverse lines/vertical lines, moveable

SNR:Support

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

Lens:C

USB interface :Standard usb2.0 interface (Type B)

Specification:

Model: Camera with HDMI USB2.0 two output

Image format: jpg,png,tiff

Image resolution: 4320*3240 (for TF card) 1920 *1080 @ 60FPS(for TF card)

Video format: MP4

Video recorder: 1920 *1080 @ 60FPS (for TF Card)

USB Video resolution: 1920 *1080 @ 30FPS

White Balance: Auto

Light: Auto

Color: Color

Negative: Support

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese

Line: different color,5 horizontal line , 5 vertical line,any positions

C-MOUNT Lens parameter:

Working distance: 55mm-200mm

Field of view: 2.4mm-36mm

zoom c-mount Lens:

Magnification Power by 8X~120X

Size: 100mm(L) * 25mm(DIA)

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

CH003067
172,81 €

HAYEAR 14 milioni di pixel Full HD schermo di colore fotocamera digitale ingranditore microscopio

wishlist
Compare

AUOP12301

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003068
3,45 €

AUO-P12301

wishlist
Compare

SEMTECH SC471

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003069
3,45 €

SEMTECH SC471

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Compare
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