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ITE IT8572TECXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003218
3,45 €

ITE IT8572TE-CXS

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Realtek ALC3225

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003219
3,45 €

Realtek ALC3225

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218S6ECLA13FG SB600

218S6ECLA13FG SB600

Part Number 218S6ECLA13FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0813

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003220
11,14 €

218S6ECLA13FG SB600

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1m cavo sata SAS MiniSAS SFF80x8087 36P A 4 SATA 7P Linea di cavi Hard Disk

Cabledeconn G0101 MINI SAS 36P SFF 8087 to 4 SATA 7P Cable 0.5m 12Gbps Hard Drive Data Transmission Splitter Cord

What is the SAS cable?

SAS is a point-to-point connected storage system that has many advantages over previous parallel SCS connection systems. It is a smaller, more flexible serial design connection system that replaces SCS. The SAS connector allows the device to be connected via a cable or directly to the backboard. Data transmission speed can reach 12Gbps.

Features:

Data transmission cable, MINI SAS 36P SFF 8087 to SATA 7P.

Transmission rate up to 12Gbps, fast quick.

Plug and use, universal for various size of the hard drive.

Support hot swap, SATA interface.

Specifications:

Model: G0101

Working Frequency: High Frequency

Application Area: Network Communication

Interface Type: SATA/ATA

Shape: Strip

Line Length: 500mm/19.69"/ 30cm

Features: Fire Retardant

Number Of Pin: 36P

Notes:

1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!

2. Please allow 1-3mm measuring deviation due to manual measurement.

CH003221
12,31 €

1m cavo SAS sata Mini-SAS SFF-8087 a 4 cavi SATA Mini SAS 4i SFF8087 36P a 4 SATA 7P Linea di cavi Hard Disk

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BD82Q77 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003223
5,40 €

BD82Q77 Stencil Template

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SMSC KBC1122AJZS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003224
4,77 €

SMSC KBC1122AJZS

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6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003225
8,58 €

6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template

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AM950BADY23AB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003226
4,35 €

AM950BADY23AB Stencil Template

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N10MNSSA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003227
5,40 €

N10M-NS-S-A3 Stencil Template

ITE IT8572TECXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003218
3,45 €

ITE IT8572TE-CXS

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Realtek ALC3225

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003219
3,45 €

Realtek ALC3225

wishlist
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218S6ECLA13FG SB600

218S6ECLA13FG SB600

Part Number 218S6ECLA13FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0813

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003220
11,14 €

218S6ECLA13FG SB600

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Compare

1m cavo sata SAS MiniSAS SFF80x8087 36P A 4 SATA 7P Linea di cavi Hard Disk

Cabledeconn G0101 MINI SAS 36P SFF 8087 to 4 SATA 7P Cable 0.5m 12Gbps Hard Drive Data Transmission Splitter Cord

What is the SAS cable?

SAS is a point-to-point connected storage system that has many advantages over previous parallel SCS connection systems. It is a smaller, more flexible serial design connection system that replaces SCS. The SAS connector allows the device to be connected via a cable or directly to the backboard. Data transmission speed can reach 12Gbps.

Features:

Data transmission cable, MINI SAS 36P SFF 8087 to SATA 7P.

Transmission rate up to 12Gbps, fast quick.

Plug and use, universal for various size of the hard drive.

Support hot swap, SATA interface.

Specifications:

Model: G0101

Working Frequency: High Frequency

Application Area: Network Communication

Interface Type: SATA/ATA

Shape: Strip

Line Length: 500mm/19.69"/ 30cm

Features: Fire Retardant

Number Of Pin: 36P

Notes:

1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!

2. Please allow 1-3mm measuring deviation due to manual measurement.

CH003221
12,31 €

1m cavo SAS sata Mini-SAS SFF-8087 a 4 cavi SATA Mini SAS 4i SFF8087 36P a 4 SATA 7P Linea di cavi Hard Disk

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BD82Q77 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003223
5,40 €

BD82Q77 Stencil Template

wishlist
Compare

SMSC KBC1122AJZS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003224
4,77 €

SMSC KBC1122AJZS

wishlist
Compare

6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003225
8,58 €

6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template

wishlist
Compare

AM950BADY23AB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003226
4,35 €

AM950BADY23AB Stencil Template

wishlist
Compare

N10MNSSA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003227
5,40 €

N10M-NS-S-A3 Stencil Template

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Nuova batteria A1417 per Apple Macbook

Description :

Battery type: Li-ion

Battery Model: A1495

Battery Voltage: 10.95V

Battery Capacity: 95Whr 8460mAh

Color: Black

Compatibility : For Apple Macbook

Part Number : 020-7469-A

CH003228
47,12 €

Nuova batteria A1417 per Apple Macbook

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