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EMMCEMCPUFSFont BGA153162169186221254 Kit per la stazione di Stencil Solder

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003587
47,12 €

EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Kit per la stazione di Stencil Solder

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GP104750A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003588
9,96 €

Modello GP104-750-A1 Stencil 90*90

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Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad 3423cm

Multifunctional Repair /Soldering Mat

Silicone Heat Mat Set: * Silicone Heat Mat Repair Insulation Kit Mobile Computer Tablets Phones Fix Pad

Insulation, Retardant, Anti-skid, Anti-static, Anti-corrosion, Magnetic Storage, Odorless, Foldable

FEATURES:

?500C Heat Resistant

?Strong Classification and Storage Performance, make your working desk clean and tiny and improve work efficiency

?Heat Accumulation Characteristics: Accumulate heat on this pad. It will be quicker and more convenient while soldering the CPU

?Eco-friendly Silicone: Non-toxic, odorless. The mat is made of high quality silicone. It resists corrosion and out of shape. Its texture is soft, solid and durable to protect soldering iron tip.

?Easy to clean: It easily cleaned nice with soap and water or even rubbing alcohol in daily use. Mats environmental safety is conducive to improving the working environment of technicians.

?Professional Heat Isolation Mat: And you can also use it big pads as pot holders for pots, pans, trays...

?You can even place it that is heat-resistant, non-slip on tables or counters for pots and pans.

SPECIFICATIONSS:

-Item Name: Multipurpose Repair pad/Soldering Mat

-Dimension: 340*230*5mm

-Weight: 235g

-Material: Silicone

-Color: Blue

CH003589
8,58 €

Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad 34*23cm

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M5Y10 SR217 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003592
7,46 €

M-5Y10 SR217 Stencil Template

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QUALCOMM890VV

MSM8909-0VV QUALCOMM

Part Number MSM8909 Manufacturer QUALCOMM

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003593
7,94 €

QUALCOMM8909-0VV

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GM204700A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003594
6,22 €

Modello di Stencil GM204-700-A1

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Maxim MAX1715EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003595
3,45 €

Maxim MAX1715EEI

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RT8876A GQW RICHTEK

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003597
3,45 €

RT8876A GQW RICHTEK

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SR3RZ N5000

SR3RZ N5000

Part Number SR3RZ N5000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003598
73,85 €

SR3RZ N5000

EMMCEMCPUFSFont BGA153162169186221254 Kit per la stazione di Stencil Solder

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003587
47,12 €

EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Kit per la stazione di Stencil Solder

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GP104750A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003588
9,96 €

Modello GP104-750-A1 Stencil 90*90

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Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad 3423cm

Multifunctional Repair /Soldering Mat

Silicone Heat Mat Set: * Silicone Heat Mat Repair Insulation Kit Mobile Computer Tablets Phones Fix Pad

Insulation, Retardant, Anti-skid, Anti-static, Anti-corrosion, Magnetic Storage, Odorless, Foldable

FEATURES:

?500C Heat Resistant

?Strong Classification and Storage Performance, make your working desk clean and tiny and improve work efficiency

?Heat Accumulation Characteristics: Accumulate heat on this pad. It will be quicker and more convenient while soldering the CPU

?Eco-friendly Silicone: Non-toxic, odorless. The mat is made of high quality silicone. It resists corrosion and out of shape. Its texture is soft, solid and durable to protect soldering iron tip.

?Easy to clean: It easily cleaned nice with soap and water or even rubbing alcohol in daily use. Mats environmental safety is conducive to improving the working environment of technicians.

?Professional Heat Isolation Mat: And you can also use it big pads as pot holders for pots, pans, trays...

?You can even place it that is heat-resistant, non-slip on tables or counters for pots and pans.

SPECIFICATIONSS:

-Item Name: Multipurpose Repair pad/Soldering Mat

-Dimension: 340*230*5mm

-Weight: 235g

-Material: Silicone

-Color: Blue

CH003589
8,58 €

Isolamento di riparazione della stuoia di calore del silicone Kit Tablet per computer mobili Telefoni Fix Pad 34*23cm

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M5Y10 SR217 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003592
7,46 €

M-5Y10 SR217 Stencil Template

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QUALCOMM890VV

MSM8909-0VV QUALCOMM

Part Number MSM8909 Manufacturer QUALCOMM

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003593
7,94 €

QUALCOMM8909-0VV

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GM204700A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003594
6,22 €

Modello di Stencil GM204-700-A1

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Maxim MAX1715EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003595
3,45 €

Maxim MAX1715EEI

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RT8876A GQW RICHTEK

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003597
3,45 €

RT8876A GQW RICHTEK

wishlist
Compare

SR3RZ N5000

SR3RZ N5000

Part Number SR3RZ N5000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003598
73,85 €

SR3RZ N5000

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