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Realtek ALC880

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003612
3,45 €

Realtek ALC880

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900MT4C KINGBOX 936 testa termostatica testa saldante senza piombo

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.

CH003613
3,61 €

900M-T-4C KINGBOX 936 testa di saldatura senza piombo testa termostatica

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10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258BN Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003614
9,82 €

10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258-BN Stencil Template

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mela 339S0171

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003615
7,94 €

mela 339S0171

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2160856000

216-0856000

Part Number 216-0856000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1343

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003616
49,46 €

216-0856000

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DC Alimentazione DPS305BF Digital Control DC Tensione regolata 30V 5A HONGSHENG 220V

Login to Download: * Manual Download

Product Description:

DPS series digital input adjustable DC power supply is designed for laboratory, school, production lines and electronic repair designed for use. Voltage stability is high, small ripple factor, has improved the short circuit protection and over current protection.

Due to the voltage value is a digital keyboard input, shorten the voltage setting time and completely overcome the traditional potentiometer adjustment poor contact caused by voltage instability phenomenon. The internal power supply containing electronic switch can conveniently open the output load.

Name: Power Supply

Model: DPS-305BF

Condition: Brand New From Factory

Output Voltage: 0-30V Accuracy: 0.1V

Constant Current Value: 0-5A Accuracy: 0.01A

OCP Current: 0-5A Accuracy: 0.01A

Shows Four Current Measurement Accuracy

0000-0 .450 A 0.001A

0.450 ---- 5A 0.01A

Five Current Display Accuracy

00000-0 .0450 A 0.0001A

0.0450-0.450A 0.001A

0.450 ---- 5A 0.01A

5PS current display accuracy up to 0.0001A (0.1 mA), the most high-end laptops and smart phones have standby current less than 1 mA, DPS Power supply is currently the only accurate to 0.1 mA DC power supply.

Package Included:

1 X Power Supply

1 X Power Cord

1 X User Manual

Notice:

Depending on the input voltage, this machine has 110V and 220V, Please leave a message, tell us which type you want.

CH003617
73,35 €

DC Alimentazione DPS-305BF Digital Control DC Tensione regolata 30V 5A HONGSHENG 220V

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ITE IT8511TE BXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003618
3,45 €

ITE IT8511TE (BXA)

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TI TPS51218

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003619
3,45 €

TI TPS51218

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N13EGS1LPA1

N13E-GS1-LP-A1

Part Number N13E-GS1-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1207

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003621
124,72 €

N13E-GS1-LP-A1

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Realtek RTL8211BL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003623
3,45 €

Realtek RTL8211BL

wishlist
Compare
Quickview

2150798006 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003624
9,96 €

217/84 del Consiglio Stencil Template 90*90

Realtek ALC880

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003612
3,45 €

Realtek ALC880

wishlist
Compare

900MT4C KINGBOX 936 testa termostatica testa saldante senza piombo

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.

CH003613
3,61 €

900M-T-4C KINGBOX 936 testa di saldatura senza piombo testa termostatica

wishlist
Compare

10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258BN Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003614
9,82 €

10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258-BN Stencil Template

wishlist
Compare

mela 339S0171

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003615
7,94 €

mela 339S0171

wishlist
Compare

2160856000

216-0856000

Part Number 216-0856000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1343

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003616
49,46 €

216-0856000

wishlist
Compare

DC Alimentazione DPS305BF Digital Control DC Tensione regolata 30V 5A HONGSHENG 220V

Login to Download: * Manual Download

Product Description:

DPS series digital input adjustable DC power supply is designed for laboratory, school, production lines and electronic repair designed for use. Voltage stability is high, small ripple factor, has improved the short circuit protection and over current protection.

Due to the voltage value is a digital keyboard input, shorten the voltage setting time and completely overcome the traditional potentiometer adjustment poor contact caused by voltage instability phenomenon. The internal power supply containing electronic switch can conveniently open the output load.

Name: Power Supply

Model: DPS-305BF

Condition: Brand New From Factory

Output Voltage: 0-30V Accuracy: 0.1V

Constant Current Value: 0-5A Accuracy: 0.01A

OCP Current: 0-5A Accuracy: 0.01A

Shows Four Current Measurement Accuracy

0000-0 .450 A 0.001A

0.450 ---- 5A 0.01A

Five Current Display Accuracy

00000-0 .0450 A 0.0001A

0.0450-0.450A 0.001A

0.450 ---- 5A 0.01A

5PS current display accuracy up to 0.0001A (0.1 mA), the most high-end laptops and smart phones have standby current less than 1 mA, DPS Power supply is currently the only accurate to 0.1 mA DC power supply.

Package Included:

1 X Power Supply

1 X Power Cord

1 X User Manual

Notice:

Depending on the input voltage, this machine has 110V and 220V, Please leave a message, tell us which type you want.

CH003617
73,35 €

DC Alimentazione DPS-305BF Digital Control DC Tensione regolata 30V 5A HONGSHENG 220V

wishlist
Compare

ITE IT8511TE BXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003618
3,45 €

ITE IT8511TE (BXA)

wishlist
Compare

TI TPS51218

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003619
3,45 €

TI TPS51218

wishlist
Compare

N13EGS1LPA1

N13E-GS1-LP-A1

Part Number N13E-GS1-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1207

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003621
124,72 €

N13E-GS1-LP-A1

wishlist
Compare

Realtek RTL8211BL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003623
3,45 €

Realtek RTL8211BL

wishlist
Compare

2150798006 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003624
9,96 €

217/84 del Consiglio Stencil Template 90*90

wishlist
Compare
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