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RICHTEK RT9203CS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004971
3,45 €

RICHTEK RT9203CS

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MSP MP2625GLZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004972
3,45 €

MSP MP2625GL-Z

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Tester della CPU della scheda di caricamento del manichino della scheda di caricamento del portatile 1150

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

CH004973
10,57 €

Tester della CPU della scheda di caricamento del manichino della scheda di caricamento del portatile 1150

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MX25L8005

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004974
3,45 €

MX25L8005

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Sensore di misura del misuratore di temperatura LCD digitale TM902C

Specification:

Brand new

Type: K

Material: fiberglass

Size: approx. 24*72*108 mm

Cable length: 1M

Line 2 * 0.4 (Diameter of the wire is 0.4mm )

Temperature range: -50~ 300?

Measurement range: -50? to 750?

Resolution: 1?

Working temperature: 0 to 50?

Storage temperature: -30 to 60?

Probe measuring range: -50 to 204 ?

Humidity: = 80%RH

Power supply: one 9V battery (not included)

Feature:

LCD screen, easy to read.

Low power consumption.

High accuracy and stability.

Safe and reliable.

Durable in use.

Convenient and easy to operate.

Accuracy:

0? to 500?: +(0.75%+1?)

500? to 750?: +(1%+1?)

0? to 20?: +2?

-20? to -40?: +3?

-40? to -50?: +4?

Packaged included:

1 x K Type Thermometer With Thermocouple Probe

CH004975
7,27 €

Sensore di misura del misuratore di temperatura LCD digitale TM-902C

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TI TPS659102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004976
3,45 €

TI TPS659102

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G84602A2 8600MGT 64BIT 128Mb

G84-602-A2 8600MGT 64Bit 128Mb

Part Number G84-602-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1244

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004977
17,23 €

G84-602-A2 8600MGT 64Bit 128Mb

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i76820HQ SR2FU Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004978
9,50 €

I7-6820HQ SR2FU Stencil Template 90*90

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EME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004979
5,40 €

EME350GBB22GT Stencil Template

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N13EGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004980
7,46 €

N13E-GT-W-A2 Stencil Template

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N16EGSKABA1

N16E-GS-KAB-A1

Part Number N16E-GS-KAB-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004981
131,28 €

N16E-GS-KAB-A1

RICHTEK RT9203CS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004971
3,45 €

RICHTEK RT9203CS

wishlist
Compare

MSP MP2625GLZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004972
3,45 €

MSP MP2625GL-Z

wishlist
Compare

Tester della CPU della scheda di caricamento del manichino della scheda di caricamento del portatile 1150

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

CH004973
10,57 €

Tester della CPU della scheda di caricamento del manichino della scheda di caricamento del portatile 1150

wishlist
Compare

MX25L8005

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004974
3,45 €

MX25L8005

wishlist
Compare

Sensore di misura del misuratore di temperatura LCD digitale TM902C

Specification:

Brand new

Type: K

Material: fiberglass

Size: approx. 24*72*108 mm

Cable length: 1M

Line 2 * 0.4 (Diameter of the wire is 0.4mm )

Temperature range: -50~ 300?

Measurement range: -50? to 750?

Resolution: 1?

Working temperature: 0 to 50?

Storage temperature: -30 to 60?

Probe measuring range: -50 to 204 ?

Humidity: = 80%RH

Power supply: one 9V battery (not included)

Feature:

LCD screen, easy to read.

Low power consumption.

High accuracy and stability.

Safe and reliable.

Durable in use.

Convenient and easy to operate.

Accuracy:

0? to 500?: +(0.75%+1?)

500? to 750?: +(1%+1?)

0? to 20?: +2?

-20? to -40?: +3?

-40? to -50?: +4?

Packaged included:

1 x K Type Thermometer With Thermocouple Probe

CH004975
7,27 €

Sensore di misura del misuratore di temperatura LCD digitale TM-902C

wishlist
Compare

TI TPS659102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004976
3,45 €

TI TPS659102

wishlist
Compare

G84602A2 8600MGT 64BIT 128Mb

G84-602-A2 8600MGT 64Bit 128Mb

Part Number G84-602-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1244

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004977
17,23 €

G84-602-A2 8600MGT 64Bit 128Mb

wishlist
Compare

i76820HQ SR2FU Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004978
9,50 €

I7-6820HQ SR2FU Stencil Template 90*90

wishlist
Compare

EME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004979
5,40 €

EME350GBB22GT Stencil Template

wishlist
Compare

N13EGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004980
7,46 €

N13E-GT-W-A2 Stencil Template

wishlist
Compare

N16EGSKABA1

N16E-GS-KAB-A1

Part Number N16E-GS-KAB-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004981
131,28 €

N16E-GS-KAB-A1

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