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ZOTEK VC15B True RMS 6000 conta l'autonomia automatica ACDC Multimetro digitale

Features:

Auto ranges

True RMS measurement

550V protection in resistance and capacitor atoms

Large LCD display, MAX display 6000 counts

Sample rate: 3 times per second

Backlight

Polarity identification

Low voltage indication

20A high current measurement is available

Auto power off

Main measurements: AC / DC Voltage, AC / DC Current, Resistance, Capacitance,

Diode and Continuity Testing, Frequency and duty cycle.

Frequency: 1Hz to 20MHz

Capacitance: 10pF to 6000uF

AC volts: 0.1mV to 750V

DC volts: 0.1mV to 1000V

AC current: 0.1uA to 20A

DC current: 0.1uA to 20A

Resistance: 0.1O to 60MO

Duty cycle: 1% to 99%

Specifications:

(1) frequency: 5/50/500 / 5k / 50k / 500k / 5M / 20M (+/- 0.1 + 3)

(+/- 5.0% + 5), 1000uF / 10000uF (+/- 5.0% + 5), 100nF / 1uF / 10uF / 100uF (+/- 2.0% + 5)

(3) DC volt: 600 mV (+/- 1.0% + 10), 6V / 60V / 600V / 1000V (+/- 0.5% + 3)

(4) AC volt: 600 mV (+/- 3.0% + 3), 6 V / 60 V / 600 V / 750 V (1.0% + 3)

(5) ACA / DCA: 600uA / 6000uA (+/- 1.5% + 3), 60mA / 600mA / 20A (+/- 1.5% + 3)

(+/- 0.5% + 3),6K/60K/600K/6M(+/- 0.5% + 2),60MO(+/-1.5% + 3)

(7) Duty cycle: 1% to 99% (+/- 1%)

(8) Measurement mode: Double-integral style A / D transform

(9) Over range indication: OL

(10) Working environment: 0 ~ 40 ?, relative humidity Less than 80%

(11) Supply power: 3V (1.5V AA batteries * 2 Pcs) (Not included)

(12) Dimension: 180*90*45mm

(13)Material:plastic

(14)Color:Blue

Package List:

1 x VC15B + multimeter

1 x a pair of test leads

1 x User manual

Only the above package content, other products are not included.

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

CH005227
18,42 £

ZOTEK VC15B+ Vero RMS 6000 conta la gamma automatica AC/DC Multimetro digitale

OZMICRO OZ960S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005228
2,95 £

OZMICRO OZ960S

2160846009

216-0846009

Part Number 216-0846009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1435

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005231
53,66 £

216-0846009

NF6150NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005232
4,62 £

NF-6150-N-A2 Stencil Template

DC Power Jack parte PJ031

Dell Latitude DC Power Jack Connector: C-Series, CP, CPi, CPiA, CPiD, CPiR, CPm, CPt, CPtC, CPtS, CPtV, CPx, CPxH, CPxJ, CS, CSR, CSX, C400, C500, C510, C540, C600, C610, C640, C800, C805, C810, C840, C-Dock, C-Port, V700, V710, V740, Xpi 133ST, Xpi 75, Xpi CD, Xpi P100SD, XPi P133

Dell Inspiron DC Power Jack Connector: 1100, 2500, 2600, 2650, 3650, 3700, 3800, 4000, 4100, 4150, 5000, 5000E, 5100, 7500, 8000, 8100, 8200

Dell Precision Workstation DC Power Jack Connector: M40, M50

CH005233
6,17 £

DC Power Jack, parte #PJ031

N14EGTXWA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005234
8,53 £

N14E-GTX-W-A2 Stencil Template 90*90

CD3301B TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005235
2,95 £

CD3301B TI

OZMICRO OZ960N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005236
4,08 £

OZMICRO OZ960N

i72635QM SR030 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005238
4,62 £

i7-2635QM SR030 Stencil Template

INTEL LE82GLE960 SLA9G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005239
20,41 £

INTEL LE82GLE960 SLA9G

WOLFSON WM8326G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005240
5,44 £

WOLFSON WM8326G

ZOTEK VC15B True RMS 6000 conta l'autonomia automatica ACDC Multimetro digitale

Features:

Auto ranges

True RMS measurement

550V protection in resistance and capacitor atoms

Large LCD display, MAX display 6000 counts

Sample rate: 3 times per second

Backlight

Polarity identification

Low voltage indication

20A high current measurement is available

Auto power off

Main measurements: AC / DC Voltage, AC / DC Current, Resistance, Capacitance,

Diode and Continuity Testing, Frequency and duty cycle.

Frequency: 1Hz to 20MHz

Capacitance: 10pF to 6000uF

AC volts: 0.1mV to 750V

DC volts: 0.1mV to 1000V

AC current: 0.1uA to 20A

DC current: 0.1uA to 20A

Resistance: 0.1O to 60MO

Duty cycle: 1% to 99%

Specifications:

(1) frequency: 5/50/500 / 5k / 50k / 500k / 5M / 20M (+/- 0.1 + 3)

(+/- 5.0% + 5), 1000uF / 10000uF (+/- 5.0% + 5), 100nF / 1uF / 10uF / 100uF (+/- 2.0% + 5)

(3) DC volt: 600 mV (+/- 1.0% + 10), 6V / 60V / 600V / 1000V (+/- 0.5% + 3)

(4) AC volt: 600 mV (+/- 3.0% + 3), 6 V / 60 V / 600 V / 750 V (1.0% + 3)

(5) ACA / DCA: 600uA / 6000uA (+/- 1.5% + 3), 60mA / 600mA / 20A (+/- 1.5% + 3)

(+/- 0.5% + 3),6K/60K/600K/6M(+/- 0.5% + 2),60MO(+/-1.5% + 3)

(7) Duty cycle: 1% to 99% (+/- 1%)

(8) Measurement mode: Double-integral style A / D transform

(9) Over range indication: OL

(10) Working environment: 0 ~ 40 ?, relative humidity Less than 80%

(11) Supply power: 3V (1.5V AA batteries * 2 Pcs) (Not included)

(12) Dimension: 180*90*45mm

(13)Material:plastic

(14)Color:Blue

Package List:

1 x VC15B + multimeter

1 x a pair of test leads

1 x User manual

Only the above package content, other products are not included.

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

CH005227
18,42 £

ZOTEK VC15B+ Vero RMS 6000 conta la gamma automatica AC/DC Multimetro digitale

OZMICRO OZ960S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005228
2,95 £

OZMICRO OZ960S

2160846009

216-0846009

Part Number 216-0846009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1435

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005231
53,66 £

216-0846009

NF6150NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005232
4,62 £

NF-6150-N-A2 Stencil Template

DC Power Jack parte PJ031

Dell Latitude DC Power Jack Connector: C-Series, CP, CPi, CPiA, CPiD, CPiR, CPm, CPt, CPtC, CPtS, CPtV, CPx, CPxH, CPxJ, CS, CSR, CSX, C400, C500, C510, C540, C600, C610, C640, C800, C805, C810, C840, C-Dock, C-Port, V700, V710, V740, Xpi 133ST, Xpi 75, Xpi CD, Xpi P100SD, XPi P133

Dell Inspiron DC Power Jack Connector: 1100, 2500, 2600, 2650, 3650, 3700, 3800, 4000, 4100, 4150, 5000, 5000E, 5100, 7500, 8000, 8100, 8200

Dell Precision Workstation DC Power Jack Connector: M40, M50

CH005233
6,17 £

DC Power Jack, parte #PJ031

N14EGTXWA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005234
8,53 £

N14E-GTX-W-A2 Stencil Template 90*90

CD3301B TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005235
2,95 £

CD3301B TI

OZMICRO OZ960N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005236
4,08 £

OZMICRO OZ960N

i72635QM SR030 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005238
4,62 £

i7-2635QM SR030 Stencil Template

INTEL LE82GLE960 SLA9G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005239
20,41 £

INTEL LE82GLE960 SLA9G

WOLFSON WM8326G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005240
5,44 £

WOLFSON WM8326G