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  • Marca: Andk Kzt Hmilu
  • Marca: Chipsetpro.com
  • Marca: Svod-project
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DC Power Jack parte PJ032

HP/Compaq Business Notebook DC Power Jack Connector: NC6220, NC6230, NC8000, NW8000, NX5000

Compaq Presario V1000 Series DC Power Jack Connector: V1000 CTO, V1001AD, V1001AP, V1002AD, V1002AP, V1003AD, V1003AP, V1004, V1004AD, V1004AP, V1005AD, V1005AP, V1006AD, V1006AP, V1007AD, V1007AP, V1008AD, V1008AP, V1009AD, V1009AP, V1010AP, V1011AP, V1012AP, V1013AP, V1014AP, V1015AP, V1016AP, V1017AP, V1018AP, V1019AP, V1020AP, V1021AP, V1022AP, V1023AP, V1024AP, V1025AP, V1026AP, V1027AP, V1028AP, V1029AP, V1030AP, V1031AP, V1032AP, V1033AP, V1034AP, V1035AP, V1036AP, V1037AP, V1038AP, V1039AP, V1040AP, V1041AP, V1042AP, V1043xx, V1044AP, V1045AP, V1046AP, V1047AP, V1048AP, V1049AP, V1050AP, V1051AP, V1052AP, V1053AP, V1054AP, V1055AP, V1056AP, V1057AP, V1058AP, V1059AP, V1060AP, V1061AP, V1062AP, V1065AP, V1066AP, V1067AP, V1068AP, V1069AP, V1070AP, V1071AP, V1072AP, V1073AP, V1074AP, V1075AP, V1100 CTO, V1101AP, V1102AP, V1103AP, V1104AP, V1105AP, V1106AP, V1107AP, V1108AP, V1109AP, V1110AP, V1111AP, V1112AP, V1113AP, V1114AP, V1115AP, V1116AP, V1117AP, V1118AP, V1119AP, V1120AP, V1121AP, V1122AP, V1123AP, V1124AP, V1125AP, V1126AP, V1127AP, V1128AP, V1129AP, V1130AP, V1131AP, V1132AP, V1133AP, V1134AP

CH005193
7,21 €

DC Power Jack, parte #PJ032

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5931577B Touchpad Trackpad per MacBook Pro 13 A1425 2012 2013

Item Specification:

Product Name

Trackpad Touchpad Mouse Flex Cable for Apple MacBook Pro 13" A1425 2012 2013

Product Condition

NEW

Compatible Models:

Compatible Model

MacBook Pro A1425 13" 2012 2013 Retina

Compatible Subfamily

A1425

MacBook Pro "Core i5" 2.5 13" Retina

MacBook Pro "Core i7" 2.9 13" Retina

MacBook Pro "Core i5" 2.6 13" Retina 2013

MacBook Pro "Core i7" 3.0 13" Retina 2013

Compatible Model No

MD212LL/A*, ME662LL/A, ME864LL/A* ME866LL/A MGX92LL/A

CH005195
48,49 €

593-1577-B Trackpad Touchpad per MacBook Pro 13 A1425 2012 2013

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ITE IT8510 GXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005196
3,45 €

ITE IT8510 (GXA)

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MCP7APB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005197
5,40 €

Modello di Stencil MCP7A-P-B1

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Ventola di raffreddamento per Asus G71 G72 F70 F90x90 X71 X73 X90

Cooler Fan for Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90

Part Number Asus G71 G72 Manufacturer China

Voltage 5V Type CPU Fan

Power Connection 4-Pin Brand Unbranded/Generic

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005198
9,32 €

Ventola di raffreddamento per Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90

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Realtek ALC271X 6x6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005199
3,45 €

Realtek ALC271X (6x6)

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15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008 2010 2011

Geniune/ Original Apple MacBook Pro A1286 15 LCD LVDS Screen Ribbon Flex Cable 2008, 2009, 2010 & 2011 only!

Removed from new MacBook, some signs of removal possible but they are in good condition

Compatible Order Numbers:

MC371LL/A

MC372LL/A

MC373LL/A

MC721LL/A

MC723LL/A

MD104LL/A

MD035LL/A

MB470LL/A

MB471LL/A

MC026LL/A

MD318LL/A

MD322LL/A

MC118LL/A

MB985LL/A

MB986LL/A

CH005201
13,22 €

15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008 2010 2011

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GD900 con rivestimento in argento di calore composto Grease termica passato

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

Color Gray Thermal Conductivity >4.8W/M-K

Speciflc Gravity >2.3g/cc Operating Temperature -58~464?

Weight 1g Description Brand New

GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle: Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.

Method of use: It's normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).

Warm notice: Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.

Storage: Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.

CH005203
6,09 €

GD900 con rivestimento in argento di calore composto Grease termica passato

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N3050 SR2A9 Stencil Template

N3050 SR2A9 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005204
6,22 €

N3050 SR2A9 Stencil Template

DC Power Jack parte PJ032

HP/Compaq Business Notebook DC Power Jack Connector: NC6220, NC6230, NC8000, NW8000, NX5000

Compaq Presario V1000 Series DC Power Jack Connector: V1000 CTO, V1001AD, V1001AP, V1002AD, V1002AP, V1003AD, V1003AP, V1004, V1004AD, V1004AP, V1005AD, V1005AP, V1006AD, V1006AP, V1007AD, V1007AP, V1008AD, V1008AP, V1009AD, V1009AP, V1010AP, V1011AP, V1012AP, V1013AP, V1014AP, V1015AP, V1016AP, V1017AP, V1018AP, V1019AP, V1020AP, V1021AP, V1022AP, V1023AP, V1024AP, V1025AP, V1026AP, V1027AP, V1028AP, V1029AP, V1030AP, V1031AP, V1032AP, V1033AP, V1034AP, V1035AP, V1036AP, V1037AP, V1038AP, V1039AP, V1040AP, V1041AP, V1042AP, V1043xx, V1044AP, V1045AP, V1046AP, V1047AP, V1048AP, V1049AP, V1050AP, V1051AP, V1052AP, V1053AP, V1054AP, V1055AP, V1056AP, V1057AP, V1058AP, V1059AP, V1060AP, V1061AP, V1062AP, V1065AP, V1066AP, V1067AP, V1068AP, V1069AP, V1070AP, V1071AP, V1072AP, V1073AP, V1074AP, V1075AP, V1100 CTO, V1101AP, V1102AP, V1103AP, V1104AP, V1105AP, V1106AP, V1107AP, V1108AP, V1109AP, V1110AP, V1111AP, V1112AP, V1113AP, V1114AP, V1115AP, V1116AP, V1117AP, V1118AP, V1119AP, V1120AP, V1121AP, V1122AP, V1123AP, V1124AP, V1125AP, V1126AP, V1127AP, V1128AP, V1129AP, V1130AP, V1131AP, V1132AP, V1133AP, V1134AP

CH005193
7,21 €

DC Power Jack, parte #PJ032

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5931577B Touchpad Trackpad per MacBook Pro 13 A1425 2012 2013

Item Specification:

Product Name

Trackpad Touchpad Mouse Flex Cable for Apple MacBook Pro 13" A1425 2012 2013

Product Condition

NEW

Compatible Models:

Compatible Model

MacBook Pro A1425 13" 2012 2013 Retina

Compatible Subfamily

A1425

MacBook Pro "Core i5" 2.5 13" Retina

MacBook Pro "Core i7" 2.9 13" Retina

MacBook Pro "Core i5" 2.6 13" Retina 2013

MacBook Pro "Core i7" 3.0 13" Retina 2013

Compatible Model No

MD212LL/A*, ME662LL/A, ME864LL/A* ME866LL/A MGX92LL/A

CH005195
48,49 €

593-1577-B Trackpad Touchpad per MacBook Pro 13 A1425 2012 2013

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ITE IT8510 GXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005196
3,45 €

ITE IT8510 (GXA)

wishlist
Compare

MCP7APB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005197
5,40 €

Modello di Stencil MCP7A-P-B1

wishlist
Compare

Ventola di raffreddamento per Asus G71 G72 F70 F90x90 X71 X73 X90

Cooler Fan for Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90

Part Number Asus G71 G72 Manufacturer China

Voltage 5V Type CPU Fan

Power Connection 4-Pin Brand Unbranded/Generic

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005198
9,32 €

Ventola di raffreddamento per Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90

wishlist
Compare

Realtek ALC271X 6x6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005199
3,45 €

Realtek ALC271X (6x6)

wishlist
Compare

15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008 2010 2011

Geniune/ Original Apple MacBook Pro A1286 15 LCD LVDS Screen Ribbon Flex Cable 2008, 2009, 2010 & 2011 only!

Removed from new MacBook, some signs of removal possible but they are in good condition

Compatible Order Numbers:

MC371LL/A

MC372LL/A

MC373LL/A

MC721LL/A

MC723LL/A

MD104LL/A

MD035LL/A

MB470LL/A

MB471LL/A

MC026LL/A

MD318LL/A

MD322LL/A

MC118LL/A

MB985LL/A

MB986LL/A

CH005201
13,22 €

15Apple MacBook Pro A1286 Display Cable LCD LVDS 2008 2010 2011

wishlist
Compare

GD900 con rivestimento in argento di calore composto Grease termica passato

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

Color Gray Thermal Conductivity >4.8W/M-K

Speciflc Gravity >2.3g/cc Operating Temperature -58~464?

Weight 1g Description Brand New

GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle: Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.

Method of use: It's normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).

Warm notice: Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.

Storage: Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.

CH005203
6,09 €

GD900 con rivestimento in argento di calore composto Grease termica passato

wishlist
Compare

N3050 SR2A9 Stencil Template

N3050 SR2A9 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005204
6,22 €

N3050 SR2A9 Stencil Template

wishlist
Compare
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