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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
9,96 €

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90*90

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Revisione:

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
3,45 €

Revisione:

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Programmatore universale XELTEK SuperPro 610P con 28 codice adattatore plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adapter

1 * SOP16-DIP16 (300mil) Adapter

1 * SOP20-DIP20 (300mil) Adapter

1 * SOP28-DIP28 (300mil) Adapter

1 * TSSOP16-DIP16 (170mil) Adapter

1 * TSSOP20-DIP20 (170mil) Adapter

1 * TSSOP24-DIP24 (170mil) Adapter

1 * TSSOP28-DIP28 (170mil) Adapter

1 * SSOP20-DIP20 (220mil) Adapter

1 * SSOP28-DIP28 (220mil) Adapter

1 * SSOP34-DIP34 (220mil) Adapter

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adapter

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adapter

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adapter

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adapter

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adapter

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adapter

1 * QFN8 WSON8 Simple Adapter

1 * SOP16/8-DIP8 REV4 Simple Adapter

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adapter

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adapter

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
520,00 €

Programmatore universale XELTEK SuperPro 610P con 48 Universal Pin-drivers + 28 Adattatore codice EDID

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LE82P31 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
5,40 €

LE82P31 Stencil Template

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Scheda SOP16 DIP8 REV3

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
2,70 €

Scheda REV3 SOP16/8-DIP8

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i53210M SR0N0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005253
9,96 €

I5-3210M SR0N0 Stencil Template 90*90

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216MEP6CLA14FG RS600ME

216MEP6CLA14FG RS600ME

Part Number 216MEP6CLA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0804

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005255
27,83 €

216MEP6CLA14FG RS600ME

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21607690x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005256
9,96 €

216-0769010 Stencil Template 90*90

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LGE2112

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005257
17,44 €

LGE2112-AL

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
9,96 €

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90*90

wishlist
Compare

Revisione:

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
3,45 €

Revisione:

wishlist
Compare

Programmatore universale XELTEK SuperPro 610P con 28 codice adattatore plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adapter

1 * SOP16-DIP16 (300mil) Adapter

1 * SOP20-DIP20 (300mil) Adapter

1 * SOP28-DIP28 (300mil) Adapter

1 * TSSOP16-DIP16 (170mil) Adapter

1 * TSSOP20-DIP20 (170mil) Adapter

1 * TSSOP24-DIP24 (170mil) Adapter

1 * TSSOP28-DIP28 (170mil) Adapter

1 * SSOP20-DIP20 (220mil) Adapter

1 * SSOP28-DIP28 (220mil) Adapter

1 * SSOP34-DIP34 (220mil) Adapter

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adapter

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adapter

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adapter

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adapter

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adapter

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adapter

1 * QFN8 WSON8 Simple Adapter

1 * SOP16/8-DIP8 REV4 Simple Adapter

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adapter

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adapter

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
520,00 €

Programmatore universale XELTEK SuperPro 610P con 48 Universal Pin-drivers + 28 Adattatore codice EDID

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LE82P31 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
5,40 €

LE82P31 Stencil Template

wishlist
Compare

Scheda SOP16 DIP8 REV3

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
2,70 €

Scheda REV3 SOP16/8-DIP8

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i53210M SR0N0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005253
9,96 €

I5-3210M SR0N0 Stencil Template 90*90

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Compare

216MEP6CLA14FG RS600ME

216MEP6CLA14FG RS600ME

Part Number 216MEP6CLA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0804

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005255
27,83 €

216MEP6CLA14FG RS600ME

wishlist
Compare

21607690x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005256
9,96 €

216-0769010 Stencil Template 90*90

wishlist
Compare

LGE2112

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005257
17,44 €

LGE2112-AL

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