Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

TL631-Pro Diagnosis Card + MINI PCIE + A-DEBUG Desktop PCI Mainboard PCI-e Notebook Debugging Card Apple PC LPC Debug

Descrizione del prodotto:

Prova la tua dieta psu ed evitare danni costosi al tuo hardware, questo tester di alimentazione ATX.

Facile da collegare ai perni di alimentazione 20/24.

Previene danni all'hardware del computer.

Per alimentatori da 20 o 24 pin.

rapido e facile da usare.

Stato LED.

+3.3 V, +5 V, + VSB,-5V,-12V e 12 V.

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

TV160 LVDS Conversion Link Board for LG CHIMEI Samsung HDTV

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

Mini PCI/Mini PCI-E/LPC Combo-Debug-Card VIP version Notebook Combo-Debug-Card (VIP Version) User Guide

This notebook Combo-Debug Card Uses 4-layers PCB design to provide a very stable signal quality. Also, it uses Tantalum capacitance to provide good power supply. So this VIP version Debug card is more suitable to be used in poor environment. This VIP version is the upgraded version of the Combo-Debug-Card, and it supports three bus interfaces: MINI PCI, MINI PCI-E and LPC. This product is easy to use, and is designed with good stability. It is your ideal tool for notebook repair.

combo ?debug- card structure and usage

1. Mini-PCI interface:

This is used to connect this Combo Debug Card to notebooks Mini-PCI slot.

2. Mini-PCI-E interface:

This is used to connect this Combo Debug Card to notebooks Mini-PCI-e slot

3. LPC interface:

This is used to connect this Combo Debug Card to notebooks LPC connector.

4. ASIC

5. Two 7-segment LEDS:

This is used to display the Error-code

6. Test port:

This port is reserved, and end-user should not use this port.

7. indicator : this is for showing the status of CLK and RST signal.

The Mini-PCI interface in the Combo-Debug-Card

Mini PCI is a general interface, which is used in notebook. It includes 124 pins. This combo-debug-card doesnt fully use those pins, and only 101 pins are used. When installing this combo-debug-card to your notebook main-board , you will find the combo-debug-card is shorter than the notebook Mini-PCI slot. This is correct, and it servers better for you to plug or unplug this combo-debug-card.

The Mini-PCI-e interface in the Combo-Debug-Card

Mini-PCI is used as a trend in the new notebooks. Comparing to Mini-PCI, Mini-PCI-e occupies less space. This Combo-Debug-Card doesnt use all of the Mini-PCI-e bus pins. And only the below pins are used: PIN-8, PIN-10, PIN-12, PIN-14, PIN-16, PIN-17, and PIN-19. in the Mini-PCI-e spec, those pins are reserved, and it is not standard, so some of Notebook manufacturers define it as a LPC debug-port. And more and more notebook manufacturers are using this standard, such as IBM, Toshiba, HP, ASUS, TCL and etc??this Combo-Debug-Card can only work in the notebooks, which are with the LPC debug-port definition. For the notebooks, which dont support this LPC debug-port definition, this Combo-debug-card PCI-E interface will not work.

Note: Please be aware that Mini-PCI-e is supported with limitation, and it can works in most of notebooks, but not all.

The LPC interface in the Combo-Debug-Card

For the user, whose notebooks dont support the Mini-PCI interface and the Mini-PCI-e interface, you can use the third port: LPC interface. LPC interface exists in all notebook main-boards. In the Combo-Debug-Card, from left to right, the LPC definition is:

PIN1-LFRAME?, PIN2-LAD3, PIN3-LAD2, PIN4-LAD1, PIN5-LAD0, PIN6-GND, PIN7-LRESET?, PIN8- LCLK, PIN9-3.3V

Usually, the notebook boards havent LPC connectors or slots. And the users will need to connect this LPC port to the notebook by using wires. Below is some description for how to connect the Combo-Debug-Card to your notebook through this LPC interface.

If your notebooks use LPC VBIOS, you can connect the Combo-Debug-Card to your notebooks VBIOS bus.

LPC VBIOS Pin definition:

PIN2-RST? PIN13-LAD0 PIN14-LAD1 PIN15-LAD2 PIN16-GND PIN17-LAD3 PIN23-LFRAME? PIN25-VCC PIN31-CLK

You can connect this Combo-Debug-Card to any LPC bus. Some LPC interface chips are listed as below. You can connect the Combo-Debug-Card to the corresponding pins. For more information, please refer those chips datasheets.

Note: this Combo-Debug-Card uses 3.3V as power supply, and you can use any 3V3 and GND signals in your notebook main-board. Please be aware that connecting the Combo-Debug-Card to a non-3.3V power may damage this Combo-Debug-Card.

For IBM X 60 notebooks, the LPC interfaces are located in the U39 slot of the main-board. The Pin definitions are as below: A2->LRESET? A3->LFRAME? A5->LCLK A9->LAD3 A10->LAD2 A11->LAD1 A12->LAD0

For IBM T6 R6 notebooks, the LPC interfaces are located in the J26 slot of the main-board. The Pin definitions are as below: A1->LCLK, A3->LFRAME? B2->LRESET? B7->LAD3 A7->LAD2 B6->LAD1 A6->LAD0

The LED-Display in the Combo-Debug-Card

The Display includes Error-Code display, Bus-Type display, and CLK,RST signal, status display .

1, Error-Code display: It is composed with two 7-segment LED s.

2, Bus-Type display: The two Dots of the LED s are used to indicate the notebook bus type. The left side Dot is for Mini-PCI bus, and the right side Dot is for Mini-PCI-e and LPC bus. When the notebook works in Mini-PCI bus, the right side Dot will be lighted.

3, CLK, RST signal status display: when you hold on the notebooks RESET button, the RST indicator will be lighted, and the CLK indicator will be off. When you release the notebook RESET button, the RST indicator will be off, and the CLK indicator will be twinkled.

Part of Error-Code explanation

When the notebooks are running, this Combo-Debug-Card will show the corresponding debug code. If there is a problem in the notebook, you can judge the problem by the debug code. Below is the explanation for some main error codes.

AWARD BIOS:The explanation when the Combo-Debug-Card shows the below debug codes.

Code Explanation

C0 Close cache

01 Processor test

07 CMOS test

C1 Memory size test

0A Set the interrupt table

0C Initiate the keyboard

0D Initiate the Graphic card

1A Show CPU frequency

3C CMOS setting

42 Initiate hardware

52 Test the extended ROM

FF Boot

AMI BIOS: The explanation when the Combo-Debug-Card shows the below debug codes.

Code Explanation

00 Error in self test

01 Error in processor test

0D,0F Error in CMOS test

1A~22 Error in Memory test

3A Error in graphic card

FF Pass the self test

Q/A

Question: RST indicator is off, but CLK indicator is NOT twinkled.

Answer: this symptom shows there is no CLK signal for debug card so that the CLK indicator isnt twinkled .Usually, it may mean the motherboard can NOT support this Mini-PCI-e interface. Please use Mini-PCI or LPC interface to test it.

Question: RST indicator is off ,and CLK indicator is twinkled. But it shows 00

Answer: In this case, please check the Bus-Type display to check if the Bus-Type display is corresponding to the bus type.

Features

Auto ranges

550V protection in Resistance?Capacitance and Frequency ranges

Large LCD display,MAX display 4000 counts

Sample rate: 3 times per second

backlight

Data hold

Relative measurement

Polarity identification

Low voltage indication

10A high current and low current measurement

Auto power off

Main measurements:AC/DC Voltage, AC/DC Current, Resistance,Capacitance, Diode and Continuity Testing,Frequency and duty cycle

* Frequency:1Hz to 10MHz

* Capacitance :10pF to 4000uF

* AC volts: 0.1mV to 750V

* DC volts:0.1mV to 1000V

* AC current:0.1uA to 10A

* DC current:0.1uA to 10A

* Resistance :0.1O to 40MO

* Duty cycle:1% to 99%

Specifications

(1)Capacitance :4nF(5.0%+4),40nF(2.5%+4),400nF/4.000uF/40.00uF/400.0uF/1000uF /4000uF(3.5%+4)

(2)DC volts:400mV/4V/40V(0.5%+4),400V/600V(0.8%+4)

(3)AC volts: 400mV(1.5%+4), 4V/40V/400V(1.2%+4),600V(1.5%+4)

(4)DC current:40mA/400mA(1.0%+4),10A(1.5%+4)

(5)AC current:40mA/400mA/10A(2.0%+4 ,50-200Hz)

(6)Resistance :400O/4K/40K/400K/4M(0.8%+4),40MO(2.0%+4)

(7)Frequency:99.5/999.5/9.999k/99.99k/999.9k/9.999MHz (0.08%+2)

(9)Duty cycle:0.1% to 99.9%(0.08%+2)

(10) Measurement mode: ?S mode

(11)Over range indication: OL

(12) Working environment: 0~40?, relative humidity < 80%

(13) Supply power: 3V (1.5V AAA batteries * 2 Pcs)

(14) Dimension: 130*65*30mm

Package including

1 pc digital multimeter

TV160-4 Converter (V-BY-ONE to LVDS Converter)-4K Mainboard maintenance test tool

TV160-4K converter (V-BY-ONE to turn the LVDS converter): it can directly will now 4K motherboard market of

V-BY-ONE (VB1) of direct conversion of LVDS signal, with 6 generation TV160 converter supports 4K motherboard repair test

and so on, has the advantages of simple operation, high ratio of performance to price.

TV160-4K converter, TD, design and development of maintenance test 4K motherboard converter, with six generations of LVDS

VGA converter to restore the image of about 6 LVDS-LVDS converter is buy web site is as follows:

TV160-4K converter features:

1, TV160-4K converter, currently supports: input L / g, Innolux (former CMO screen), Huaxing Power 4K screen VB1 (V-BY-ONE) interface. Insert it directly in the original line screen machines can be converted into 1080p LVDS signal V-BY-ONE signal output of 4K motherboard.

2, with the 6 generation LVDS-VGA converter (can also support the 3 generation LVDS-VGA display, but does not support the 5 generation LVDS-VGA converter), to complete the current 4K motherboard repair test, the measured excellent SKY WORTH 4K motherboard effect.

3, the converter support group 2 V-BY-ONE signal conversion, part of the motherboard can complete display images, but part of the motherboard because of 4K display mode, only half of the image display, maintenance and test no problem, such as unwilling to accept part of the motherboard that half of the image customers buy!

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente