Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

I7-5600U SR23V

Numero parte SR23V i7-5600U Costruttore Marca INTEL

BGA Alloy No Pb/Lead Free Data Code 16+

Pacchetto/Case 1 PCS Designazione delle merci Nuovo

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

1 set DC Power 5.5*2.1mm Jack to 8 Plug Adapter Notebook + SAMSUNG HP Connector

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

Mini PCI/Mini PCI-E/LPC Combo-Debug-Card VIP version Notebook Combo-Debug-Card (VIP Version) User Guide

This notebook Combo-Debug Card Uses 4-layers PCB design to provide a very stable signal quality. Also, it uses Tantalum capacitance to provide good power supply. So this VIP version Debug card is more suitable to be used in poor environment. This VIP version is the upgraded version of the Combo-Debug-Card, and it supports three bus interfaces: MINI PCI, MINI PCI-E and LPC. This product is easy to use, and is designed with good stability. It is your ideal tool for notebook repair.

combo ?debug- card structure and usage

1. Mini-PCI interface:

This is used to connect this Combo Debug Card to notebooks Mini-PCI slot.

2. Mini-PCI-E interface:

This is used to connect this Combo Debug Card to notebooks Mini-PCI-e slot

3. LPC interface:

This is used to connect this Combo Debug Card to notebooks LPC connector.

4. ASIC

5. Two 7-segment LEDS:

This is used to display the Error-code

6. Test port:

This port is reserved, and end-user should not use this port.

7. indicator : this is for showing the status of CLK and RST signal.

The Mini-PCI interface in the Combo-Debug-Card

Mini PCI is a general interface, which is used in notebook. It includes 124 pins. This combo-debug-card doesnt fully use those pins, and only 101 pins are used. When installing this combo-debug-card to your notebook main-board , you will find the combo-debug-card is shorter than the notebook Mini-PCI slot. This is correct, and it servers better for you to plug or unplug this combo-debug-card.

The Mini-PCI-e interface in the Combo-Debug-Card

Mini-PCI is used as a trend in the new notebooks. Comparing to Mini-PCI, Mini-PCI-e occupies less space. This Combo-Debug-Card doesnt use all of the Mini-PCI-e bus pins. And only the below pins are used: PIN-8, PIN-10, PIN-12, PIN-14, PIN-16, PIN-17, and PIN-19. in the Mini-PCI-e spec, those pins are reserved, and it is not standard, so some of Notebook manufacturers define it as a LPC debug-port. And more and more notebook manufacturers are using this standard, such as IBM, Toshiba, HP, ASUS, TCL and etc??this Combo-Debug-Card can only work in the notebooks, which are with the LPC debug-port definition. For the notebooks, which dont support this LPC debug-port definition, this Combo-debug-card PCI-E interface will not work.

Note: Please be aware that Mini-PCI-e is supported with limitation, and it can works in most of notebooks, but not all.

The LPC interface in the Combo-Debug-Card

For the user, whose notebooks dont support the Mini-PCI interface and the Mini-PCI-e interface, you can use the third port: LPC interface. LPC interface exists in all notebook main-boards. In the Combo-Debug-Card, from left to right, the LPC definition is:

PIN1-LFRAME?, PIN2-LAD3, PIN3-LAD2, PIN4-LAD1, PIN5-LAD0, PIN6-GND, PIN7-LRESET?, PIN8- LCLK, PIN9-3.3V

Usually, the notebook boards havent LPC connectors or slots. And the users will need to connect this LPC port to the notebook by using wires. Below is some description for how to connect the Combo-Debug-Card to your notebook through this LPC interface.

If your notebooks use LPC VBIOS, you can connect the Combo-Debug-Card to your notebooks VBIOS bus.

LPC VBIOS Pin definition:

PIN2-RST? PIN13-LAD0 PIN14-LAD1 PIN15-LAD2 PIN16-GND PIN17-LAD3 PIN23-LFRAME? PIN25-VCC PIN31-CLK

You can connect this Combo-Debug-Card to any LPC bus. Some LPC interface chips are listed as below. You can connect the Combo-Debug-Card to the corresponding pins. For more information, please refer those chips datasheets.

Note: this Combo-Debug-Card uses 3.3V as power supply, and you can use any 3V3 and GND signals in your notebook main-board. Please be aware that connecting the Combo-Debug-Card to a non-3.3V power may damage this Combo-Debug-Card.

For IBM X 60 notebooks, the LPC interfaces are located in the U39 slot of the main-board. The Pin definitions are as below: A2->LRESET? A3->LFRAME? A5->LCLK A9->LAD3 A10->LAD2 A11->LAD1 A12->LAD0

For IBM T6 R6 notebooks, the LPC interfaces are located in the J26 slot of the main-board. The Pin definitions are as below: A1->LCLK, A3->LFRAME? B2->LRESET? B7->LAD3 A7->LAD2 B6->LAD1 A6->LAD0

The LED-Display in the Combo-Debug-Card

The Display includes Error-Code display, Bus-Type display, and CLK,RST signal, status display .

1, Error-Code display: It is composed with two 7-segment LED s.

2, Bus-Type display: The two Dots of the LED s are used to indicate the notebook bus type. The left side Dot is for Mini-PCI bus, and the right side Dot is for Mini-PCI-e and LPC bus. When the notebook works in Mini-PCI bus, the right side Dot will be lighted.

3, CLK, RST signal status display: when you hold on the notebooks RESET button, the RST indicator will be lighted, and the CLK indicator will be off. When you release the notebook RESET button, the RST indicator will be off, and the CLK indicator will be twinkled.

Part of Error-Code explanation

When the notebooks are running, this Combo-Debug-Card will show the corresponding debug code. If there is a problem in the notebook, you can judge the problem by the debug code. Below is the explanation for some main error codes.

AWARD BIOS:The explanation when the Combo-Debug-Card shows the below debug codes.

Code Explanation

C0 Close cache

01 Processor test

07 CMOS test

C1 Memory size test

0A Set the interrupt table

0C Initiate the keyboard

0D Initiate the Graphic card

1A Show CPU frequency

3C CMOS setting

42 Initiate hardware

52 Test the extended ROM

FF Boot

AMI BIOS: The explanation when the Combo-Debug-Card shows the below debug codes.

Code Explanation

00 Error in self test

01 Error in processor test

0D,0F Error in CMOS test

1A~22 Error in Memory test

3A Error in graphic card

FF Pass the self test

Q/A

Question: RST indicator is off, but CLK indicator is NOT twinkled.

Answer: this symptom shows there is no CLK signal for debug card so that the CLK indicator isnt twinkled .Usually, it may mean the motherboard can NOT support this Mini-PCI-e interface. Please use Mini-PCI or LPC interface to test it.

Question: RST indicator is off ,and CLK indicator is twinkled. But it shows 00

Answer: In this case, please check the Bus-Type display to check if the Bus-Type display is corresponding to the bus type.

N11E-GE-A1 GTX460M

Numero parte N11E-GE-A1 Produttore NVIDIA

BGA Alloy No Pb/Lead Free Data Code 1045

Pacchetto/Case 240 Descrizione Originale nuovo

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

ASUS Car charger for notebook 19V 3.42A 65W 5.5*2.5mm

Type DC/In-Car Manufacturer ASUS

Input DC11 - 15V max 10A Connecter Size 5.5*2.5mm

Output 19V 3.42A Condition Brand New

Compatible With:

This DC car charger is also compatible with the following models:

Asus A2 Series: A2L, A2000L

Asus A3 Series: A3A, A3Ac, A3000A, A3000Ac, A3E, A3000E, A3H, A3000H, A3L, A3000L, A3N, A3000N

Asus A5 series: A5E,A5Eb,A5Ec

Asus A6 Series: A6N, A6Ne, A6000N, A6000Ne, A6Rp, A6000Rp, A6U, A6000U, A6Vc, A6000Vc

Asus A8 Series: A8E, A8F, A8H, A8Ja, A8Jc, A8Jm, A8Jn, A8Jr, A8Jv, A8m, A8Le, A8He, A8Fm

Asus A9 Series: A9Rp, A9T

Asus B5 Series: B50A

Asus F3 Series: F3F, F3Jm, F3Jv

Asus F5 series: F5R

Asus F9 Series: F9E, F9J

Asus L2 Series: L2E, L2000E

Asus L3 Series: L3C, L3S, L3000C, L3000S, L34, L34C, L3400, L3400C

Asus L4 Series: L4E, L4R, L4000E, L4000R

Asus M2 Series: M2A, M2E, M2000A, M2000E, M2N, M2Ne, M2000N, M2000Ne

Asus M24 Series: M24, M24A, M24E, M24N, M2400, M2400A, M2400E, M2400N

Asus M3 Series: M3 M3000 M3N M3000N M3NP M3000NP

Asus M52 Series: M52A, M52Ae, M5200A, M5200Ae

Asus M6 Series: M6BN, M6BNe, M6000BN, M6000BNe, M6N, M6Ne, M6000, M6000N, M6000Ne, M6000r

Asus N10 Series: N10E, N10J, N10Jc

Asus R1 Series: R1E, R1F

Asus S1 Series: S1N, S13N, S1000N, S1300N

Asus S6 Series: S6F, S6Fm

Asus S7 series: S7F

Asus S9 Series: S96F, S96Fm VBI

ASUS U1 series: U1E, U1F

ASUS U2 series: U2E

ASUS U5 series: U5A, U5F-

ASUS U6 series: U6E, U6Ep

Asus V6 Series: V6, V6J, V6000, V6000J, V6V, V6Va, V6000V, V6000Va

Asus V68 Series: V68, V68V, V6800, V6800V

Asus W1 Series: W1, W1N, W1000, W1000N

Asus W5 Series: W5A, W5000A, W5Ae, W5000Ae, W5F, W5Fe, W5Fm, W5000F, W5000Fe, W5000Fm

Asus W6 series: W6A,W6F-,W6Fp-

Asus W7 series: W7F

Asus X50 series: X51L,X51H,X51RL,X51R

Asus X80 series: X80Le

Asus Z35 Series: Z35, Z35Fm, Z3500, Z3500Fm

Asus Z61 Series: Z61A, A61Ae, Z6100A, Z6100Ae

Asus Z63 Series: Z63A, Z6300A

Asus Z70 Series: Z70A, Z7000, Z7000A, Z70V, Z70Va, Z7000V, Z7000Va, Z70N, Z70Ne, Z7000N, Z7000Ne

Asus Z71 Series: Z71, Z71A, Z7100, Z7100A, Z71V, Z7100V, Z71Vp, Z7100Vp

Asus Z84 Series: Z84F, Z8400F

Asus Z9 Series: Z9, Z9000

Asus Z91 Series: Z91A, Z91Ac, Z9100A, Z9100Ac, Z91E, Z9100E, Z91F, Z91Fc, Z9100F, Z9100Fc, Z91N, Z9100N

Asus Z92 Series: Z92Km, Z9200Km

Asus Z93 Series: Z93E, Z9300E

Asus Z96 Series: Z96F, Z96Fm, Z9600F, Z9600Fm

Asus Lamborghini VX1

Asus SW1 VBI, U1E, U1F, U2E, U6E

Power supply ACER 19V 3.42A [65W] 5,5x1,7

Input Voltage Range 100-240V Output 19V 3.42A

Connector Size 5.5mm*1.7mm Power 65W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente

DH82HM87 SR17D

Numero parte DH82HM87 SR17D Produttori Intel

BGA Alloy No Pb/Lead Free Data Code 14+

Pacchetto/Case 1 PCS Designazione delle merci Nuovo

Supporto tecnico

BGA CHIPSET OBSERVE PRECAUMENTO PER LA MANUTENZIONE

BGA Chips è MOISTURE SENSITIVE DEVICES. I dispositivi richiedono la cottura, prima del montaggio, Ecco il processo generale di cottura, Lay il BAG sul vassoio, e metterlo in un gabinetto di cottura a secco. Impostare la temperatura e il tempo come: 125C x 24 ore o 80C x 48 ore

Prestare attenzione alla differenza tra

piombo (Pb) palle e piombo libero (No Pb) palle.

chip Pb BGA senza piombo:

245C-260C(Maximun)

Chip BGA piombo/Pb:

180C-205C(Maximun)

Azione sufficiente