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RTL8411

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001276
3,45 €

RTL8411

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QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
21,33 €

QD-FX-350MT-N-A3

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N3350 SR2Z7 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001281
9,82 €

N3350 SR2Z7 Stencil Template 90*90

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IDT 92HD80B1X5NLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001282
3,45 €

IDT 92HD80B1X5NLG

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CH341A 24 25 serie DVD EEPROM Flash BIOS programmatore USB con driver software MA

CH341A 24 25 Series DVD EEPROM Flash BIOS USB Programmer with Software Driver MA

Product Details:

USB Programmer

Condition: New

Special USB chip CH341A production, check speed about 2-3 mbit per minute

Support WIN 98, WINME, WIN2K, WINXP, VISTA, WIN7-32 system

Using USB port power supply

Support chip list

AMIC:

A25L05P,A25L10P,A25L20P,A25L40P,A25L80P,A25L16P

ATMEL:

AT25DF041A,AT25DF321,AT25F004,AT25F512A,AT25F2048,AT25F4096,AT25F1024A,AT25FS010,AT25FS040,AT26DF081A,

AT26DF161A,AT26DF321,AT26F004

EON:

EN25B05,EN25P05,EN25B10,EN25P10,EN25BF20,EN25P20,EN25F20,EN25B40,EN25P40,EN25F40,EN25B80,

EN25P80,EN25F80,EN25T80,EN25B16,EN25P16,EN25B32,EN25P32,EN25B64,EN25P64

Excel Semiconductor Inc.

ES25P10,ES25P20,ES25P40??ES25P80,ES25P16,ES25P32

ST:

M25P05A,M25P10A,M25P20,M25P40,M25P80,M25P16,M25P32,M25P64,M25PE10,M25PE20,M25PE40,

M25PE80,M25PE16,M25PE32,M45PE10,M45PE20,M45PE40,M45PE80,M45PE16,M45PE32

MXIC:

MX25L512,MX25L1005,MX25L2005,MX25L4005,MX25L8005,MX25L1605,MX25L3205,MX25L6405 MX25L6445,MX25L6405(SOP16)

NexFlash:

NX25P80,NX25P16,NX25P32

Chingis Technology Corporation

Pm25LV512,Pm25LV010,Pm25LV020,Pm25LV040,Pm25LV080,Pm25LV016,Pm25LV032,Pm25LV064

Saifun Semiconductors

SA25F005,SA25F010,SA25F020,SA25F040,SA25F080,SA25F160,SA25F320,

WINBOND:

W25P10,W25X10,W25Q10,W25P20,W25X20,W25Q20,W25P40,W25X40,W25Q40,W25P80,W25X80,W25Q80,

W25P16, W25X16,W25Q16,W25P32,W25X32,W25Q32,W25P64,W25X64,W25Q64

8 pin serial BIOS chips can erase, can read and write

Color is shown as pictures

PLS NOTE that due to lighting effects, monitor's brightness/ contrass settings ect, there could be some slight differences in the color tone of the pictures and the actual item!

Package Included:

1 x USB Programmer

CH001283
3,23 €

CH341A 24 25 serie DVD EEPROM Flash BIOS programmatore USB con driver software MA

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BCM57785XB0KMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001284
3,45 €

BCM57785XB0KMLG

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G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
24,62 €

G73-VZA-N-A2

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TI TPS61180

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001287
3,97 €

TI TPS61180

RTL8411

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001276
3,45 €

RTL8411

wishlist
Compare

QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
21,33 €

QD-FX-350MT-N-A3

wishlist
Compare

N3350 SR2Z7 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001281
9,82 €

N3350 SR2Z7 Stencil Template 90*90

wishlist
Compare

IDT 92HD80B1X5NLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001282
3,45 €

IDT 92HD80B1X5NLG

wishlist
Compare

CH341A 24 25 serie DVD EEPROM Flash BIOS programmatore USB con driver software MA

CH341A 24 25 Series DVD EEPROM Flash BIOS USB Programmer with Software Driver MA

Product Details:

USB Programmer

Condition: New

Special USB chip CH341A production, check speed about 2-3 mbit per minute

Support WIN 98, WINME, WIN2K, WINXP, VISTA, WIN7-32 system

Using USB port power supply

Support chip list

AMIC:

A25L05P,A25L10P,A25L20P,A25L40P,A25L80P,A25L16P

ATMEL:

AT25DF041A,AT25DF321,AT25F004,AT25F512A,AT25F2048,AT25F4096,AT25F1024A,AT25FS010,AT25FS040,AT26DF081A,

AT26DF161A,AT26DF321,AT26F004

EON:

EN25B05,EN25P05,EN25B10,EN25P10,EN25BF20,EN25P20,EN25F20,EN25B40,EN25P40,EN25F40,EN25B80,

EN25P80,EN25F80,EN25T80,EN25B16,EN25P16,EN25B32,EN25P32,EN25B64,EN25P64

Excel Semiconductor Inc.

ES25P10,ES25P20,ES25P40??ES25P80,ES25P16,ES25P32

ST:

M25P05A,M25P10A,M25P20,M25P40,M25P80,M25P16,M25P32,M25P64,M25PE10,M25PE20,M25PE40,

M25PE80,M25PE16,M25PE32,M45PE10,M45PE20,M45PE40,M45PE80,M45PE16,M45PE32

MXIC:

MX25L512,MX25L1005,MX25L2005,MX25L4005,MX25L8005,MX25L1605,MX25L3205,MX25L6405 MX25L6445,MX25L6405(SOP16)

NexFlash:

NX25P80,NX25P16,NX25P32

Chingis Technology Corporation

Pm25LV512,Pm25LV010,Pm25LV020,Pm25LV040,Pm25LV080,Pm25LV016,Pm25LV032,Pm25LV064

Saifun Semiconductors

SA25F005,SA25F010,SA25F020,SA25F040,SA25F080,SA25F160,SA25F320,

WINBOND:

W25P10,W25X10,W25Q10,W25P20,W25X20,W25Q20,W25P40,W25X40,W25Q40,W25P80,W25X80,W25Q80,

W25P16, W25X16,W25Q16,W25P32,W25X32,W25Q32,W25P64,W25X64,W25Q64

8 pin serial BIOS chips can erase, can read and write

Color is shown as pictures

PLS NOTE that due to lighting effects, monitor's brightness/ contrass settings ect, there could be some slight differences in the color tone of the pictures and the actual item!

Package Included:

1 x USB Programmer

CH001283
3,23 €

CH341A 24 25 serie DVD EEPROM Flash BIOS programmatore USB con driver software MA

wishlist
Compare

BCM57785XB0KMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001284
3,45 €

BCM57785XB0KMLG

wishlist
Compare

G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
24,62 €

G73-VZA-N-A2

wishlist
Compare

TI TPS61180

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001287
3,97 €

TI TPS61180

wishlist
Compare
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