Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002800
Nessuna opinione al momento
16 other products in the same category
60 modelli 1500pcs Triode SMD Common SOT23 campioni di pacchetto Kit
Brands: Chipsetpro.com
55,44 €
60 modelli 1500pcs Triode SMD Common SOT-23 campioni di pacchetto Kit
iphone5 5G USB ricarica IC 36Pin 1608A1
Brands: Chipsetpro.com
4,61 €
iphone5 5G USB ricarica IC 36Pin 1608A1
Massimo MAX1515
