Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
20 modelli 1000pcs 0402 Sunlord Ferrite Bead SMD 0R-1K8R Kit
170 Modelli 8500pcs RC0805 SMD FR-07 Serie YAGEO Resistor 1% Accuratezza Sample Book Assortimento Kit
Intersil ISL95831BHRTZ
