Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
26 modelli 650pcs Diode SMD comuni 0.5W 2.4V-30V campioni di pacchetto Kit
80 Modelli 2000pcs 1206 SMD muRata GRM31 serie Capacitor Sample Book Assortimento Kit
AMIC A25L032M-F
