Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003992
Nessuna opinione al momento
16 other products in the same category
RM102TG Pannello di controllo CHIP
Brands: Chipsetpro.com
31,77 €
RM102-TG Pannello di controllo CHIP
Chip grafico VIA PN133T BGA IC Chipset
Brands: Chipsetpro.com
30,18 €
Chip grafico VIA PN133T BGA IC Chipset
BCM53115
