Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004405
9 Articoli
Nessuna opinione al momento
16 other products in the same category
170 Modelli 8500pcs RC1206 SMD FR07 Serie YAGEO Resistor 1 assortimento di libri di precisione Kit
Brands: Chipsetpro.com
66,56 €
170 Modelli 8500pcs RC1206 SMD FR-07 Serie YAGEO Resistor 1% Accuratezza Sample Book Assortimento Kit
RT RT RT RT RT RT RT RT RT RT RT RT RT RT
Brands: Chipsetpro.com
3,45 €
RT RT RT RT RT RT RT RT RT RT RT RT RT RT
Winbond W25Q32FVSIG
