Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001272
Nessuna opinione al momento
16 other products in the same category
i52450M SR06Z Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-2450M SR06Z Stencil Template 90*90
BD82HM70 SJTNV Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
BD82HM70 SJTNV Stencil Template 90*90
EMMCEMCPUFSFont BGA153162169186221254 Kit per la stazione di Stencil Solder
Brands: Chipsetpro.com
47,12 €
EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Kit per la stazione di Stencil Solder
10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258BN Stencil Template
Brands: Chipsetpro.com
9,82 €
10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258-BN Stencil Template
SR177 SR1JJJ SR173 SR175 SR176 SR178 SR179 Stencil Template
Brands: Chipsetpro.com
5,40 €
SR177 SR1JJJ SR173 SR175 SR176 SR178 SR179 Stencil Template
N11M-PT1-S-B1 Stencil Template
