Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001417
Nessuna opinione al momento
16 other products in the same category
SONY PS4 CXD90025G Stencil Template
Brands: Chipsetpro.com
5,59 €
SONY PS4 CXD90025G Stencil Template
GP104200A1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GP104-200-A1 Stencil Template 90*90
FM880PAAY43KA Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
FM880PAAY43KA Stencil Template 90*90
BD82X79 SLJN7 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
BD82X79 SLJN7 Stencil Template 90*90
216-07742 Stencil Template
