Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001425
Nessuna opinione al momento
16 other products in the same category
GTX1070 N17EG2A1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GTX1070 N17E-G2-A1 Stencil Template 90*90
i56350HQ SR2QZ Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
I5-6350HQ SR2QZ Stencil Template 90*90
i54300U SR1ED Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i5-4300U SR1ED Stencil Template 90*90
BD82C604 SLJHV Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
BD82C604 SLJHV Stencil Template 90*90
BD82C606 SLJKH Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
BD82C606 SLJKH Stencil Template 90*90
GF-GO7600-H-N-B1 Stencil Template
