Kit SR2EYSR366 Stencil Solder Station
Brands: Chipsetpro.com
43,14 €
Kit SR2EY/SR366 Stencil Solder Station
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001470
Nessuna opinione al momento
16 other products in the same category
i52540M SR046 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i5-2540M SR046 Stencil Template 90*90
GL82Q170 SR2C5 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
GL82Q170 SR2C5 Stencil Template 90*90
i56198DU SR2NR Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i5-6198DU SR2NR Stencil Template 90*90
10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258BN Stencil Template
Brands: Chipsetpro.com
9,82 €
10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258-BN Stencil Template
AM50IBJ44HM Stencil Template
