Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001490
Nessuna opinione al momento
16 other products in the same category
G86630A2 G86631A2 GFGO7400TNA3 N10MGE1S N10MGE2 Stencil Template
Brands: Chipsetpro.com
5,40 €
G86-630-A2 G86-631-A2 GF-GO7400T-N-A3 N10M-GE1-S N10M-GE2-S Stencil Template
i52467M SR0D6 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i5-2467M SR0D6 Stencil Template 90*90
FM880PAAY43KA Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
FM880PAAY43KA Stencil Template 90*90
N17PG1BKCA1 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
N17P-G1-B-KC-A1 Stencil Template 90*90
F2117LP-20H DF2117RVPLP20HV Stencil Template
