Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001544
Nessuna opinione al momento
16 other products in the same category
21507190x90 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
215-0719090 Stencil Template 90*90
Pentium DualCore Mobile 967 SR0FC Stencil Template
Brands: Chipsetpro.com
5,40 €
Pentium Dual-Core Mobile 967 SR0FC Stencil Template
V527A184SR2EZ Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
V527A184SR2EZ Stencil Template 90*90
SB460 Stencil Template
