Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001862
Nessuna opinione al momento
16 other products in the same category
IT8586VG IT8587VG IT8517VG IT858585VG IT8518VG IT8528VG Stencil Template
Brands: Chipsetpro.com
7,46 €
IT8586VG IT8587VG IT8517VG IT858585VG IT8518VG IT8528VG Stencil Template
FH82QMS3 SR40F Stencil Template 90x90
Brands: Chipsetpro.com
9,95 €
FH82QMS3 SR40F Stencil Template 90*90
SONY PS3 D5305AFK RSX D5305F Stencil Template
