Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001864
Nessuna opinione al momento
16 other products in the same category
i55200U SR23Y Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-5200U SR23Y Stencil Template 90*90
F2117LP20H DF2117RVPLP20HV Stencil Template
Brands: Chipsetpro.com
7,46 €
F2117LP-20H DF2117RVPLP20HV Stencil Template
GL82Q170 SR2C5 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
GL82Q170 SR2C5 Stencil Template 90*90
IphoneX Modulo Stencil Template
