Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
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EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Kit per la stazione di Stencil Solder
I5-3317U SR0N8 Stencil Template 90*90
I3-7020U SR3LD Stencil Template 90*90
I3-2370M SR0DR Stencil Template 90*90
SR2FQ/SR32S Kit per la stazione di Stencil Solder
I5-5257U SR26K Stencil Template 90*90
i3-3110M SR0T4 Stencil Template
