Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
Pentium Dual-Core Mobile 967 SR0FC Stencil Template
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
i3-6167U SR2JF Stencil Template 90*90
I3-5010U SR23Z Stencil Template 90*90
i5-2415M SR071 Stencil Template 90*90
217/84 del Consiglio Stencil Template 90*90
N16E-GX-A1 Stencil Template
