N2807 SR1W5 Stencil Template
Part Number intel CPU Stencil Manufacturer ATK
Stencil Template Direct heating Metal 304 Stainless steel
Package/Case 1 PCS Description Buik new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
16 other products in the same category
IT8586VG IT8587VG IT8517VG IT858585VG IT8518VG IT8528VG Stencil Template
IT8586VG IT8587VG IT8517VG IT858585VG IT8518VG IT8528VG Stencil Template
Pentium Dual Core Mobile SR0V5 Stencil Template
Modello SR0V5 Stencil portatile a doppio strato
i54210Y SR191 Stencil Template 90x90
I5-4210Y SR191 Stencil Template 90*90
N14EGTXWA2 Stencil Template 90x90
N14E-GTX-W-A2 Stencil Template 90*90