Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
16 other products in the same category
Samsung Exynos7904J720A305G887A40SA8S Stencil Template
Brands: Chipsetpro.com
8,58 €
Samsung Exynos7904/J720/A305/G887/A40S/A8S Stencil Template
i54210U SR1EF Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i5-4210U SR1EF Stencil Template 90*90
Celeron DualCore SR08N Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
Celeron Dual-Core SR08N Stencil Template 90*90
i76920HQ SR2FT Stencil Template 90x90
Brands: Chipsetpro.com
20,11 €
I7-6920HQ SR2FT Stencil Template 90*90