Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002501
Nessuna opinione al momento
16 other products in the same category
i37100U SR343 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i3-7100U SR343 Stencil Template 90*90
SR177 SR1JJJ SR173 SR175 SR176 SR178 SR179 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
SR177 SR1JJJ SR173 SR175 SR176 SR178 SR179 Stencil Template 90*90
i77500U SR341 Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
i7-7500U SR341 Stencil Template 90*90
AM963PAEY44AB Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
AM963PAEY44AB Stencil Template 90*90
i33110M SR0T4 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i3-3110M SR0T4 Stencil Template 90*90
Modello GK110-425-A1 Stencil
