Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template
Kit SR2EY/SR366 Stencil Solder Station
N14E-GTX-W-A2 Stencil Template 90*90
I5-4200H SR15G Stencil Template 90*90
i3-2377M SR0CW Stencil Template 90*90
BD82HM77 SLJ8C Stencil Template 90*90
FH82HM370 SR40B Stencil Template
