Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002628
Nessuna opinione al momento
16 other products in the same category
i52450M SR06Z Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-2450M SR06Z Stencil Template 90*90
i36100H SR2FR Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
i3-6100H SR2FR Stencil Template 90*90
i72637M SR0D3 Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
i7-2637M SR0D3 Stencil Template 90*90
GL82HM175 SR30W Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GL82HM175 SR30W Stencil Template 90*90
i56350HQ SR2QZ Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
I5-6350HQ SR2QZ Stencil Template 90*90
GK104400A2 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GK104-400-A2 Stencil Template 90*90
BD82HM77 SLJ8C Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
BD82HM77 SLJ8C Stencil Template 90*90
i3-2365M SR0U3 Stencil Template 90*90
