Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002853
Nessuna opinione al momento
16 other products in the same category
SRCKB SRCUUU SRD1V SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template 90x90
Brands: Chipsetpro.com
23,00 €
SRCKB SRCUUU SRD1V SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template 90*90
SONY PS4 CXD90026G Stencil Template
Brands: Chipsetpro.com
5,40 €
SONY PS4 CXD90026G Stencil Template
3558U SR1E8 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
3558U SR1E8 Stencil Template 90*90
i57440EQ SR34T Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
I5-7440EQ SR34T Stencil Template 90*90
i55200U SR23Y Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-5200U SR23Y Stencil Template 90*90
Modello G84-603-A2 Stencil
