Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003033
Nessuna opinione al momento
16 other products in the same category
BD82QM67 SLJ4M Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
BD82QM67 SLJ4M Stencil Template 90*90
Samsung Exynos9820SM8150S10S10NITE10 Stencil Template
Brands: Chipsetpro.com
8,58 €
Samsung Exynos9820/SM8150/S10/S10+/NITE10 Stencil Template
i36100H SR2FR Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
i3-6100H SR2FR Stencil Template 90*90
i56267U SR2JK Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
I5-6267U SR2JK Stencil Template 90*90
Stencil Holder Reballing Station BGA Solder Station Con Magnet90x90
Brands: Chipsetpro.com
65,00 €
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station
i37100U SR2ZW Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i3-7100U SR2ZW Stencil Template 90*90
Modello GP104-300-A1 Stencil
