Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003043
Nessuna opinione al momento
16 other products in the same category
EMMCEMCPUFSFont BGA153162169186221254 Kit per la stazione di Stencil Solder
Brands: Chipsetpro.com
47,12 €
EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Kit per la stazione di Stencil Solder
i56350HQ SR2QZ Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
I5-6350HQ SR2QZ Stencil Template 90*90
Kit SR2EYSR366 Stencil Solder Station
Brands: Chipsetpro.com
43,14 €
Kit SR2EY/SR366 Stencil Solder Station
GL82H110 SR2CA Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
GL82H110 SR2CA Stencil Template 90*90
i74712HQ SR1PZ Stencil Template 90x90
Brands: Chipsetpro.com
17,81 €
I7-4712HQ SR1PZ Stencil Template 90*90
Modello di Stencil MCP67MV-A2
