Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
AM950BADY23AB Stencil Template 90*90
i3-2375M SR0U4 Stencil Template 90*90
BD82X79 SLJHW Stencil Template 90*90
i5-8250U SR3LB Stencil Template 90*90
FH82CM246 SR40E Stencil Template 90*90
6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template
