Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003225
Nessuna opinione al momento
16 other products in the same category
N4000 SR3S1 Stencil Template 90x90
Brands: Chipsetpro.com
14,92 €
N4000 SR3S1 Stencil Template 90*90
i55200U SR23Y Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-5200U SR23Y Stencil Template 90*90
6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template
