Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003317
Nessuna opinione al momento
16 other products in the same category
GL82C236 SR2CC Stencil Template 90x90
Brands: Chipsetpro.com
9,97 €
GL82C236 SR2CC Stencil Template 90*90
SR177 SR1JJJ SR173 SR175 SR176 SR178 SR179 Stencil Template
Brands: Chipsetpro.com
5,40 €
SR177 SR1JJJ SR173 SR175 SR176 SR178 SR179 Stencil Template
ODNX02A2 Stencil Solder Station Kit
Brands: Chipsetpro.com
36,67 €
ODNX02-A2 Stencil Solder Station Kits
GK104225A2 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GK104-225-A2 Stencil Template 90*90
GL82B150 SR2C7 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GL82B150 SR2C7 Stencil Template 90*90
I5-4260U SR16T Stencil Template
