Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003326
Nessuna opinione al momento
16 other products in the same category
i76820HK SR2FL Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
I7-6820HK SR2FL Stencil Template 90*90
GF114400A1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GF114-400-A1 Stencil Template 90*90
i76600U SR2F1 Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
i7-6600U SR2F1 Stencil Template 90*90
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
Brands: Chipsetpro.com
9,82 €
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
i33110M QC4V Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i3-3110M QC4V Stencil Template 90*90
Modello GK104-400-A2 Stencil
