Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003440
Nessuna opinione al momento
16 other products in the same category
i54250U SR16M Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-4250U SR16M Stencil Template 90*90
Kit SR2EYSR366 Stencil Solder Station
Brands: Chipsetpro.com
43,14 €
Kit SR2EY/SR366 Stencil Solder Station
341pcs 90x90mm Stencil TemplateBGA Stazione di Solder
Brands: Chipsetpro.com
217,56 €
341pcs 90mm*90mm Stencil Template+BGA Stazione di Solder
i53210M SR0N0 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
I5-3210M SR0N0 Stencil Template 90*90
BD82QM67 SLJ4M Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
BD82QM67 SLJ4M Stencil Template 90*90
i7-3615QM SR0MP Stencil Template
