Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003480
Nessuna opinione al momento
16 other products in the same category
SR2FQSR32S Kit per la stazione di Stencil Solder
Brands: Chipsetpro.com
36,67 €
SR2FQ/SR32S Kit per la stazione di Stencil Solder
YM2200C4T20FB YM2300C4T4MFB YM2500C4T4MFB YM2700C4T4MFB Stencil Template
Brands: Chipsetpro.com
6,22 €
YM2200C4T20FB YM2300C4T4MFB YM2500C4T4MFB YM2700C4T4MFB Stencil Template
FH82HM370 SR40B Stencil Template 90x90
Brands: Chipsetpro.com
9,95 €
FH82HM370 SR40B Stencil Template 90*90
GL82Q270 SR2WE Stencil Template 90x90
Brands: Chipsetpro.com
17,14 €
GL82Q270 SR2WE Stencil Template 90*90
i54210U SR1EF Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i5-4210U SR1EF Stencil Template 90*90
I7-4650U SR16H Stencil Template
