Stencil Holder Reballing Station BGA Solder Station Con Magnet90x90
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station
i5-2467M SR0D6 Stencil Template 90*90
I3-2310M SR04S Stencil Template 90*90
SR17D/SR17E Kit per la stazione di Stencil Solder