Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
16 other products in the same category
980 YFE TM4EA23I H6ZXRI TM4EA23IH6ZXRI Stencil Template
Brands: Chipsetpro.com
14,30 €
980 YFE TM4EA23I H6ZXRI TM4EA23IH6ZXRI Stencil Template
i56350HQ SR2QZ Stencil Template 90x90
Brands: Chipsetpro.com
9,50 €
I5-6350HQ SR2QZ Stencil Template 90*90
i36167U SR2JF Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i3-6167U SR2JF Stencil Template 90*90
i37100U SR343 Stencil Template 90x90
Brands: Chipsetpro.com
9,96 €
i3-7100U SR343 Stencil Template 90*90